1.
    发明专利
    未知

    公开(公告)号:DE3683012D1

    公开(公告)日:1992-01-30

    申请号:DE3683012

    申请日:1986-10-23

    Applicant: IBM

    Abstract: A method of detecting defects in a step- and repeat projection system used to fabricate semiconductor circuits is based on enhancing the image of a defect in one chip site without appreciably changing all other chip site images. In a step-and-repeat alignment system, a first chip site is exposed under normal intensities to print the reticle pattern at a proper exposure level. At a second chip site, exposure takes place using the same reticle (or a second identical reticle) at lower intensity levels. Given this underexposure, residual photoresist will remain at defect sites. The optical imagery at the two chip sites is different allowing comparator techniques to be used.

    2.
    发明专利
    未知

    公开(公告)号:DE3680386D1

    公开(公告)日:1991-08-29

    申请号:DE3680386

    申请日:1986-02-28

    Applicant: IBM

    Abstract: Thin opaque or non-opaque films formed on a substrate (10) are inspected by utilizing the inherent fluoresceability of the substrate material. The film-clad substrate, e.g. ceramic, is illuminated with an intense optical radiation (18) consisting of at least one wavelength which corresponds to the excitation band(s) of the ceramic component responsible for fluorescence. … For opaque films, the incident light will reach the ceramic in regions corresponding to the defects causing these ceramic regions to fluoresce at a different wavelength (20) than that of the incident light, thus providing a high contrast optical image of the defects particularly when viewed through a filter which transmits only the fluorescent radiation. … For non-opaque films, the incident light will generate fluorescent radiation over the entire substrate. The fluorescent light emanating from the defective regions will be higher than that from the non-defective regions due to absence of any absorption of the incident and fluorescent light by the defective regions of the film.

    OPTICAL DISTANCE MEASURING APPARATUS

    公开(公告)号:DE2861769D1

    公开(公告)日:1982-06-09

    申请号:DE2861769

    申请日:1978-11-27

    Applicant: IBM

    Abstract: A system for measuring the lateral displacement between edges located on two spaced apart objects, with a precision in the order of 1 microinch, generates and analyses the diffraction pattern produced by the physical edge on one object and the aerial image of the edge on the other object. The system can be used for the alignment of the objects or the comparison of patterns located on the objects.

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