公开(公告)号：DE2556560A1

公开(公告)日：1976-08-19

申请号：DE2556560

申请日：1975-12-16

Applicant: IBM

Inventor： FOSTER BETTY JANE ,  TUMMALA RAO RAMAMOHANA

IPC: H01J9/24 ,  C03C3/074 ,  C03C8/16 ,  C03C8/24 ,  C03C27/00 ,  C03C27/10 ,  C03C3/30 ,  C03C3/10 ,  H01J61/92 ,  G11B5/12

Abstract: A low temperature glass frit seal composition and process employs a paste including particulate lead glass, an organic vehicle, and small amounts of finely divided TiO2. The TiO2 prevents attack by residual organic vehicle on the lead glass during sealing and adjusts the coefficient of thermal expansion to be compatible with the substrate glass.

公开(公告)号：DE2622141A1

公开(公告)日：1977-01-20

申请号：DE2622141

申请日：1976-05-19

Applicant: IBM

Inventor： FOSTER BETTY JANE ,  LANGSTON JUN PERRY ROBERT ,  TUMMALA RAO RAMAMOHANA

IPC: C03C3/072 ,  C03C8/02 ,  C03C8/24 ,  C03C15/00 ,  C03C27/10 ,  C03C27/00 ,  H01J9/26

Abstract: The strength of high lead or alkaline earth oxide sealing glass articles is increased by treating the surface of the articles with a solution of dilute nitric acid containing about 1-10 weight percent of concentrated nitric acid in water for the time necessary to remove a thin layer of material from the surface of the article.

公开(公告)号：DE2328502A1

公开(公告)日：1974-01-03

申请号：DE2328502

申请日：1973-06-05

Applicant: IBM

Inventor： FOSTER BETTY JANE ,  TUMMALA RAO RAMAMOHANA

IPC: H01J11/00 ,  C03C3/072 ,  C03C8/10 ,  C03C17/04 ,  C03C17/36 ,  C03C27/10 ,  H01J9/24 ,  H01J9/26 ,  H01J61/92

Abstract: A method of making a gaseous discharge display and/or memory device in which no separate passivation step is required to protect the electrical conductors formed on a glass substrate. After a dielectric glass frit slurry is sprayed over the conductors and dried, the assemblage is fired in an oven to cause the dielectric to reflow and, when later cooled, to provide a smooth protective dielectric layer over the conductors. Applicants found that firing in a very wet atmosphere with neutral or oxidizing ambients causes the dielectric to reflow at a substantially lower temperature than it would in a similar but dry atmosphere. This desirably permits dielectrics of higher viscosity and consequently higher softening temperatures to now be used because the requisite firing temperature is reduced in the wet atmosphere. High viscosity dielectrics are preferred to minimize crazing of the magnisium oxide coating that is currently placed over the dielectric coating after the dielectric-substrate is cooled. Except for this reduction in firing temperature, these high viscosity dielectrics would have to be fired at temperatures over 600 DEG C., which undesirably causes warping of the soda-lime silica glass substrates currently available.