公开(公告)号：DE2613502A1

公开(公告)日：1976-11-18

申请号：DE2613502

申请日：1976-03-30

Applicant: IBM

Inventor： FRIESER RUDOLF GRUENSTAN ,  POWELL JIMMIE LEE ,  TUMMALA RAO RAMAMOHANA

IPC: C03B1/00 ,  C03B5/00 ,  C03C3/074 ,  C03C6/00 ,  C03C8/10 ,  C03C8/24 ,  C03C27/00 ,  C03B5/16 ,  C03C3/30 ,  C03C3/10

Abstract: A copper oxide containing seal glass is formed by a controlled low temperature process which reduces the formation of seeds in the glass. In one embodiment the glass is prepared in two portions with the first portion containing the high melting oxides and the second portion containing the low melting oxides. The copper oxide is added to the second portion and the two portions are combined to form the seal glass at temperatures below about 800 DEG C which reduces the formation of Cu2O crystals in the glass.

公开(公告)号：DE3484370D1

公开(公告)日：1991-05-08

申请号：DE3484370

申请日：1984-06-28

Applicant: IBM

Inventor： MASTER RAJ NAVINCHANDRA ,  TUMMALA RAO RAMAMOHANA

IPC: B41J2/425 ,  B41J2/32 ,  H01L49/02 ,  B41J2/315

Abstract: The method for fabricating a matrix print head for use in nonimpact electrolytic printers involved stacking and laminating green ceramic sheets (11) having holes (12) filled with conductive paste to form electrodes (13) then embossing the top ceramic sheet (11) with insulators (14) and screening the same with a layer (15, 16) of ruthenium dioxide. The assembiy is then sintered at less than 1000 DEG C and the resulting structure smoothed by lapping and finished in a convention fashion.

公开(公告)号：DE2833144A1

公开(公告)日：1979-02-22

申请号：DE2833144

申请日：1978-07-28

Applicant: IBM

Inventor： HUMENIK JAMES NOEL ,  POWELL JIMMIE LEE ,  TUMMALA RAO RAMAMOHANA

IPC: B41J2/135 ,  B41J2/16 ,  C03C3/076 ,  C03C3/087 ,  C03C3/089 ,  C03C3/091 ,  C03C4/20 ,  C03C3/30 ,  C03C3/04 ,  C03C3/14 ,  B41J3/04

Abstract: The lifetime of multiple capillary nozzle assemblies embedded in a glass mass, of a multiple nozzle ink-jet printer, can be increased and the thermal and mechanical compatibility of the resulting package enhanced by fabrication of the nozzles from glass compositions comprised of SiO2, ZrO2, Na2O, K2O and MgO. Inclusion of ZrO2 as well as minor amounts of BaO, MgO, CaO, and Al2O3 enhances the alkali resistance of the glass nozzles. Also, the high SiO2 content of the glasses combined with the presence of ZrO2, MgO, CaO, and Al2O3 imparts an acid resistance to the nozzles.

公开(公告)号：DE2901172A1

公开(公告)日：1979-08-16

申请号：DE2901172

申请日：1979-01-13

Applicant: IBM

Inventor： KUMAR ANANDA HOSAKERE ,  MCMILLAN PETER ,  TUMMALA RAO RAMAMOHANA

IPC: H01L21/70 ,  C03C3/083 ,  C03C3/085 ,  C03C3/091 ,  C03C10/00 ,  C03C10/06 ,  C03C10/12 ,  H01B3/02 ,  H01L21/48 ,  H01L23/08 ,  H01L23/15 ,  H01L23/52 ,  H05K1/03 ,  H05K3/46 ,  C03C3/22 ,  C03B32/00

Abstract: Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at temperatures below the melting points of these metals. This has been made possible by the discovery that finely divided powders of certain glasses described herein sinter to essentially zero porosity at temperatures below 1000 DEG C. while simultaneously maturing to glass-ceramics of low dielectric constant, high flexural strength and low thermal expansivity.

公开(公告)号：DE2556560A1

公开(公告)日：1976-08-19

申请号：DE2556560

申请日：1975-12-16

Applicant: IBM

Inventor： FOSTER BETTY JANE ,  TUMMALA RAO RAMAMOHANA

IPC: H01J9/24 ,  C03C3/074 ,  C03C8/16 ,  C03C8/24 ,  C03C27/00 ,  C03C27/10 ,  C03C3/30 ,  C03C3/10 ,  H01J61/92 ,  G11B5/12

Abstract: A low temperature glass frit seal composition and process employs a paste including particulate lead glass, an organic vehicle, and small amounts of finely divided TiO2. The TiO2 prevents attack by residual organic vehicle on the lead glass during sealing and adjusts the coefficient of thermal expansion to be compatible with the substrate glass.

公开(公告)号：DE2446742A1

公开(公告)日：1975-05-22

申请号：DE2446742

申请日：1974-10-01

Applicant: IBM

Inventor： SHERK THOMAS ALBERT ,  TUMMALA RAO RAMAMOHANA

IPC: C03C3/074 ,  C03C8/10 ,  C03C8/24 ,  C03C27/00 ,  C03B23/20 ,  C03C3/30

公开(公告)号：CH645602A5

公开(公告)日：1984-10-15

申请号：CH38779

申请日：1979-01-16

Applicant: IBM

Inventor： KUMAR ANANDA HOSAKERE ,  MCMILLAN PETER ,  TUMMALA RAO RAMAMOHANA

IPC: H01L21/70 ,  C03C3/083 ,  C03C3/085 ,  C03C3/091 ,  C03C10/00 ,  C03C10/06 ,  C03C10/12 ,  H01B3/02 ,  H01L21/48 ,  H01L23/08 ,  H01L23/15 ,  H01L23/52 ,  H05K1/03 ,  H05K3/46 ,  C03B19/06 ,  C03C3/22

公开(公告)号：DE2622141A1

公开(公告)日：1977-01-20

申请号：DE2622141

申请日：1976-05-19

Applicant: IBM

Inventor： FOSTER BETTY JANE ,  LANGSTON JUN PERRY ROBERT ,  TUMMALA RAO RAMAMOHANA

IPC: C03C3/072 ,  C03C8/02 ,  C03C8/24 ,  C03C15/00 ,  C03C27/10 ,  C03C27/00 ,  H01J9/26

Abstract: The strength of high lead or alkaline earth oxide sealing glass articles is increased by treating the surface of the articles with a solution of dilute nitric acid containing about 1-10 weight percent of concentrated nitric acid in water for the time necessary to remove a thin layer of material from the surface of the article.

公开(公告)号：DE2445713A1

公开(公告)日：1975-06-12

申请号：DE2445713

申请日：1974-09-25

Applicant: IBM

Inventor： BROWNLOW JAMES MERRITT ,  BUCHANAN RELVA CHESTER ,  TUMMALA RAO RAMAMOHANA

IPC: H01J11/02 ,  C03C3/072 ,  C03C4/16 ,  H01B3/08 ,  C03C3/12 ,  H01J61/92

公开(公告)号：DE2328502A1

公开(公告)日：1974-01-03

申请号：DE2328502

申请日：1973-06-05

Applicant: IBM

Inventor： FOSTER BETTY JANE ,  TUMMALA RAO RAMAMOHANA

IPC: H01J11/00 ,  C03C3/072 ,  C03C8/10 ,  C03C17/04 ,  C03C17/36 ,  C03C27/10 ,  H01J9/24 ,  H01J9/26 ,  H01J61/92

Abstract: A method of making a gaseous discharge display and/or memory device in which no separate passivation step is required to protect the electrical conductors formed on a glass substrate. After a dielectric glass frit slurry is sprayed over the conductors and dried, the assemblage is fired in an oven to cause the dielectric to reflow and, when later cooled, to provide a smooth protective dielectric layer over the conductors. Applicants found that firing in a very wet atmosphere with neutral or oxidizing ambients causes the dielectric to reflow at a substantially lower temperature than it would in a similar but dry atmosphere. This desirably permits dielectrics of higher viscosity and consequently higher softening temperatures to now be used because the requisite firing temperature is reduced in the wet atmosphere. High viscosity dielectrics are preferred to minimize crazing of the magnisium oxide coating that is currently placed over the dielectric coating after the dielectric-substrate is cooled. Except for this reduction in firing temperature, these high viscosity dielectrics would have to be fired at temperatures over 600 DEG C., which undesirably causes warping of the soda-lime silica glass substrates currently available.