公开(公告)号：JPH01115641A

公开(公告)日：1989-05-08

申请号：JP20486388

申请日：1988-08-19

Applicant: IBM

Inventor： ROBAATO CHIYAARUZU DAABETSUKU ,  JIEROOMU MAIKERU ERUDORITSUJI ,  FURANSHISU SHIIISHIYUN RII ,  GURAHAMU ORIIBU

IPC: B41J2/05 ,  B41J2/14

Abstract: PURPOSE: To eliminate thermal cross-talk between adjacent heater means by providing heat shield means that liberates heat from the space between each of the heater means. CONSTITUTION: Provided in the space above a heat insulation layer 13 between each resistive heater element 12 is array of thin film metal fingers 20 attached to a surface of the heat insulation layer 13. The metal fingers 20 are made of the same material as the common electrode 15 and monolithically connected to it so that they can be fabricated by simple modification of the mask used in fabrication of the common electrode 15. The most of heat generated by the resistive heater elements 12 is carried away with the common electrode 15 and control electrodes 16. The metal fingers 20 not only carry heat from this region directly into the substrate but also function to return heat to the common electrode 15 along the fingers 20, thereby the problem of thermal cross-talk is solved.