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公开(公告)号:JPH01115641A
公开(公告)日:1989-05-08
申请号:JP20486388
申请日:1988-08-19
Applicant: IBM
Inventor: ROBAATO CHIYAARUZU DAABETSUKU , JIEROOMU MAIKERU ERUDORITSUJI , FURANSHISU SHIIISHIYUN RII , GURAHAMU ORIIBU
Abstract: PURPOSE: To eliminate thermal cross-talk between adjacent heater means by providing heat shield means that liberates heat from the space between each of the heater means. CONSTITUTION: Provided in the space above a heat insulation layer 13 between each resistive heater element 12 is array of thin film metal fingers 20 attached to a surface of the heat insulation layer 13. The metal fingers 20 are made of the same material as the common electrode 15 and monolithically connected to it so that they can be fabricated by simple modification of the mask used in fabrication of the common electrode 15. The most of heat generated by the resistive heater elements 12 is carried away with the common electrode 15 and control electrodes 16. The metal fingers 20 not only carry heat from this region directly into the substrate but also function to return heat to the common electrode 15 along the fingers 20, thereby the problem of thermal cross-talk is solved.
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公开(公告)号:JPS63312843A
公开(公告)日:1988-12-21
申请号:JP6476588
申请日:1988-03-19
Applicant: IBM
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公开(公告)号:JPS62269346A
公开(公告)日:1987-11-21
申请号:JP8494187
申请日:1987-04-08
Applicant: IBM
Inventor: EFUREIMU BEMISU FURINTO , PIITAA ARUFURETSUDO GURUBAA , RONARUDO FURANKURIN MAAKUSU , GURAHAMU ORIIBU , AASAA RICHIYAADO JINGAA
IPC: H01L23/36 , H01L23/373 , H01L23/433 , H01L23/473
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公开(公告)号:JPH0280253A
公开(公告)日:1990-03-20
申请号:JP19279689
申请日:1989-07-27
Applicant: IBM
Inventor: AREN SUTEIRINGU KIYANPUBERU , JIEROOMU MAIKERU ERUDORITSUJI , FURANSHISU SHIII-SHIYUUN RII , GURAHAMU ORIIBU
Abstract: PURPOSE: To avoid a damage caused by a cavitation or to largely reduce it by combining a plurality of bubbles generated from a plurality of heating parts at the time of applying an electric signal to grow to a single bubble not annular above an opening, and injecting ink droplets from a nozzle. CONSTITUTION: Bubbles normally generate nuclide of bubbles at both parts of slender part 23 for forming bubbles 26a and both parts of an end 24 for forming bubbles 26b. The bubbles 26b are formed slightly thinner than the bubbles 26a according to a slight difference of a current density. Thus, when the forming time is deviated, they can be combined to one foam. These bubbles 26a and 26b are continuously grown, and combined at the periphery and center for growing the bubbles, that is, combined. Since the bubbles 26a and 26b are grown to a single pillow-shaped bubble 22, it is directed by a moment of the state having sufficient energy toward a nozzle 19 for discharging the ink. At the time of collapsing, the bubble is contracted toward the center of the heating structure (shape) having no resistive material due to the presence of a small slender opening 25.
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公开(公告)号:JPS63274556A
公开(公告)日:1988-11-11
申请号:JP7488188
申请日:1988-03-30
Applicant: IBM
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公开(公告)号:JPS6132449A
公开(公告)日:1986-02-15
申请号:JP6402785
申请日:1985-03-29
Applicant: Ibm
Inventor: DEIIN ERITSUKU IISUTOMAN , JIEROOMU MAIKERU ERUDORITSUJI , KAATO EDOWAADO PIITAASEN , GURAHAMU ORIIBU
IPC: F28F27/02 , H01L23/473 , H05K7/20
CPC classification number: H01L23/4332 , F28F9/0278 , H01L23/473 , H01L2224/16 , H01L2924/3011
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