公开(公告)号：SG79267A1

公开(公告)日：2001-03-20

申请号：SG1999003464

申请日：1999-07-01

Applicant: IBM

Inventor： GARY A JOHANSSON ,  BERND KARL APPELT ,  KONSTANTINOS I PAPATHOMAS

IPC: H01L21/60 ,  H01L21/52 ,  H01L21/58 ,  H01L21/607 ,  H01L23/12 ,  H01L23/14

Abstract: An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads.

公开(公告)号：SG81961A1

公开(公告)日：2001-07-24

申请号：SG1999000588

申请日：1999-03-13

Applicant: IBM

Inventor： GARY A JOHANSSON ,  KONSTANTINOS I PAPATHOMAS

IPC: B32B15/08 ,  H05K1/03 ,  C08K3/00 ,  C08K5/00 ,  C08L63/00 ,  C08L79/00 ,  C08L101/00 ,  H05K1/02 ,  H05K3/46

Abstract: A composition for use in making high optical contrast and UV light fluorescing dielectric material usuable in printed circuit boards, which in turn may form part of an electronic package. The composition comprises a resin, a coloring agent, and a fluorescing agent. A dielectric material is also defined that comprises a reinforcing material combined with the composition, the dielectric material forming at least one layer in combination with at least one conductive layer for the electronic package.