公开(公告)号：MY125344A

公开(公告)日：2006-07-31

申请号：MYPI20003159

申请日：2000-07-10

Applicant: IBM

Inventor： KONSTANTINOS I PAPATHOMAS ,  STEPEHN LESLIE BUCHWALTER ,  HUNG MANH DANG ,  MICHAEL ANTHONY GAYNES

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/433 ,  H01L23/52

Abstract: AN ELECTRONIC STRUCTURE BONDABLE TO AN ELECTRONIC ASSEMBLY, SUCH AS CHIP.THE ELECTRONIC STRUCTURE MAY BE JOINED TO A ELECTRONIC ASSEMBLY, SUCH AS CHIP, BY USE OF A STRUCTURAL EPOXY ADHESIVE. THE ELECTRONIC STRUCTURE INCLUDES A MINERAL LAYER ON A METALLIC PLATE, AND AN ADHESION PROMOTER LAYER ON THE MINERAL LAYER. THE METALLIC PLATE INCLUDES A METALLIC SUBTANCE THAT INCLUDES A PURE METAL WITH OR WITHOUT A METAL COATING. THE METALLIC SUBTANCE MAY INCLUDE SUCH SUBTANCES AS STAINLESS STEEL,ALUMINIUM,TITANIUM,COPPER,COPPER COATED WITH NICKEL,AND COPPER COATED WITH CHROME. THE MINERAL LAYER INCLUDES A CHEMICAL COMPOUND DERIVED FROM A MINERAL; E.G.,SILICON(SIO?) DERIVED FROM QUARTZ. SUCH CHEMICAL COMPOUNDS MAY INCLUDE SUCH SUBTANCES AS SILICON DIOXIDE, SILICON NITRIDE, AND SILICON CARBIDE. THE CHEMICAL COMPOUND MAY EXIST IN EITHER CRYSTALLINE AMORPHOUS FORM. THE ADHESION PROMOTER MAY INCLUDE SUCH CHEMICAL SUBTANCES AS SILANES, TITANATES, ZIRCONATES, AND ALUMINATES.(FIGURE 4)

公开(公告)号：SG79267A1

公开(公告)日：2001-03-20

申请号：SG1999003464

申请日：1999-07-01

Applicant: IBM

Inventor： GARY A JOHANSSON ,  BERND KARL APPELT ,  KONSTANTINOS I PAPATHOMAS

IPC: H01L21/60 ,  H01L21/52 ,  H01L21/58 ,  H01L21/607 ,  H01L23/12 ,  H01L23/14

Abstract: An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads.

公开(公告)号：SG103264A1

公开(公告)日：2004-04-29

申请号：SG200003983

申请日：2000-07-17

Applicant: IBM

Inventor： STEPHEN LESLIE BUCHWALTER ,  HUNG MANH DANG ,  MICHAEL A GAYNES ,  KONSTANTINOS I PAPATHOMAS

IPC: H01L23/31 ,  H01L23/433 ,  H01L23/48

Abstract: An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO 2 ) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.

公开(公告)号：SG104260A1

公开(公告)日：2004-06-21

申请号：SG200003378

申请日：2000-06-15

Applicant: IBM

Inventor： DONALD S FARQUHAR ,  KONSTANTINOS I PAPATHOMAS ,  MARK D POLIKS

IPC: B32B15/082 ,  C08K3/00 ,  C08L27/12 ,  C08L101/00 ,  H01L23/14 ,  H05K1/02 ,  H05K1/03 ,  H05K3/38

Abstract: A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.

公开(公告)号：SG81961A1

公开(公告)日：2001-07-24

申请号：SG1999000588

申请日：1999-03-13

Applicant: IBM

Inventor： GARY A JOHANSSON ,  KONSTANTINOS I PAPATHOMAS

IPC: B32B15/08 ,  H05K1/03 ,  C08K3/00 ,  C08K5/00 ,  C08L63/00 ,  C08L79/00 ,  C08L101/00 ,  H05K1/02 ,  H05K3/46

Abstract: A composition for use in making high optical contrast and UV light fluorescing dielectric material usuable in printed circuit boards, which in turn may form part of an electronic package. The composition comprises a resin, a coloring agent, and a fluorescing agent. A dielectric material is also defined that comprises a reinforcing material combined with the composition, the dielectric material forming at least one layer in combination with at least one conductive layer for the electronic package.