公开(公告)号：GB2603404A

公开(公告)日：2022-08-03

申请号：GB202205189

申请日：2020-08-26

Applicant: IBM

Inventor： THOMAS WEISS ,  CHARLES LEON ARVIN ,  GLENN POMERANTZ ,  RACHEL OLSON ,  MARK WILLIAMS KAPFHAMMER ,  BHUPENDER SINGH

IPC: H01L23/544 ,  H01L21/56 ,  H01L21/60 ,  H01L23/538

Abstract: An alignment carrier, assembly and methods that enable the precise alignment and assembly of two or more semiconductor die using an interconnect bridge. The alignment carrier includes a substrate composed of a material that has a coefficient of thermal expansion that substantially matches that of an interconnect bridge. The alignment carrier further includes a plurality of solder balls located on the substrate and configured for alignment of two or more semiconductor die.