公开(公告)号：DE2140582B2

公开(公告)日：1975-06-19

申请号：DE2140582

申请日：1971-08-13

Applicant: IBM

Inventor： GRANDIA J ,  POTEMSKI R M ,  WOODALL J M

IPC: C30B19/06 ,  H01L21/208 ,  B01J17/06

公开(公告)号：FR2104258A5

公开(公告)日：1972-04-14

申请号：FR7129448

申请日：1971-07-30

Applicant: IBM

Inventor： GRANDIA J ,  POTEMSKI R M ,  WOODALL J M

IPC: C30B19/06 ,  H01L21/208 ,  B01J17/00 ,  H01B3/00

公开(公告)号：NL175535B

公开(公告)日：1984-06-18

申请号：NL7111290

申请日：1971-08-16

Applicant: IBM

Inventor： GRANDIA J ,  POTEMSKI R M ,  WOODALL J M

IPC: C30B19/06 ,  H01L21/208 ,  C30B19/00 ,  H01L21/368

公开(公告)号：NL175535C

公开(公告)日：1984-11-16

申请号：NL7111290

申请日：1971-08-16

Applicant: IBM

Inventor： GRANDIA J ,  POTEMSKI R M ,  WOODALL J M

IPC: C30B19/06 ,  H01L21/208 ,  C30B19/00 ,  H01L21/368

公开(公告)号：CH548791A

公开(公告)日：1974-05-15

申请号：CH1198871

申请日：1971-08-16

Applicant: IBM

Inventor： GRANDIA J ,  POTEMSKI R M ,  WOODALL J M

IPC: C30B19/06 ,  H01L21/208 ,  B01J17/02

公开(公告)号：AU516065B2

公开(公告)日：1981-05-14

申请号：AU3483178

申请日：1978-04-06

Applicant: IBM

Inventor： GRANDIA J ,  HILL J C

IPC: B24B27/06 ,  B28D1/00 ,  B28D5/00 ,  B28D5/02 ,  C30B33/00 ,  H01L21/302 ,  H01L21/461 ,  H01L21/68

Abstract: A process for slicing boules of a single crystal material such as gadolinium gallium garnet (GGG) into wafers is described. The boule is prepared, by grinding preferably, so that the longitudinal boule axis corresponds to the crystallographic orientation axis of the boule. The boule is then mounted in a fixture and aligned so that the common longitudinal axis and crystallographic orientation axis is perpendicular to the saw blade. The boule is then rotated while maintaining the orientation of the combined common axis and engaged against an inner diameter rotating saw blade for a time sufficient for the blade to slice through the boule and form a wafer. The wafers obtained by this slicing process may be directly polished without the conventional lapping step to form a wafer having a surface that is substantially flat, parallel and defect free.

公开(公告)号：BR7803511A

公开(公告)日：1979-04-24

申请号：BR7803511

申请日：1978-06-01

Applicant: IBM

Inventor： HILL J ,  GRANDIA J

IPC: B24B27/06 ,  B28D1/00 ,  B28D5/00 ,  B28D5/02 ,  C30B33/00

Abstract: A process for slicing boules of a single crystal material such as gadolinium gallium garnet (GGG) into wafers is described. The boule is prepared, by grinding preferably, so that the longitudinal boule axis corresponds to the crystallographic orientation axis of the boule. The boule is then mounted in a fixture and aligned so that the common longitudinal axis and crystallographic orientation axis is perpendicular to the saw blade. The boule is then rotated while maintaining the orientation of the combined common axis and engaged against an inner diameter rotating saw blade for a time sufficient for the blade to slice through the boule and form a wafer. The wafers obtained by this slicing process may be directly polished without the conventional lapping step to form a wafer having a surface that is substantially flat, parallel and defect free.

公开(公告)号：BE771417A

公开(公告)日：1971-12-31

申请号：BE771417

申请日：1971-08-17

Applicant: IBM

Inventor： GRANDIA J ,  WOODALL R M POTEMSKIET J M

IPC: C30B19/06 ,  H01L21/208 ,  B01J

公开(公告)号：SE377055B

公开(公告)日：1975-06-23

申请号：SE978071

申请日：1971-07-30

Applicant: IBM

Inventor： GRANDIA J ,  POTEMSKI R M ,  WOODALL J M

IPC: C30B19/06 ,  H01L21/208 ,  B01J17/06

公开(公告)号：AU459061B2

公开(公告)日：1975-03-13

申请号：AU3240971

申请日：1971-08-16

Applicant: IBM

Inventor： GRANDIA J ,  POTEMSKI R M ,  WOODALL J M

IPC: C30B19/06 ,  H01L21/208