1.
    发明专利
    未知

    公开(公告)号:DE68920291T2

    公开(公告)日:1995-07-06

    申请号:DE68920291

    申请日:1989-10-10

    Applicant: IBM

    Abstract: A method is provided for forming a conductive stud and line over a surface (12), comprising the steps of forming at least a first layer of material (14) over the region on the surface whereat the conductive stud and line are to be formed; forming a layer (22) of dual image photoresist over the material; exposing the dual image photoresist to radiation so as to form at least first and second regions (22A, 22B, 22C) exhibiting different development characteristics; developing the first region (22A) so as to expose a portion of the material; removing the exposed portion of the material so as to define the position of one of the conductive line or stud; developing the second region to expose more of the material; and removing the newly exposed portion of material so as to define the position of the other of the conductive line (16 min /18 min ) or stud (20 min ).

    2.
    发明专利
    未知

    公开(公告)号:DE68920291D1

    公开(公告)日:1995-02-09

    申请号:DE68920291

    申请日:1989-10-10

    Applicant: IBM

    Abstract: A method is provided for forming a conductive stud and line over a surface (12), comprising the steps of forming at least a first layer of material (14) over the region on the surface whereat the conductive stud and line are to be formed; forming a layer (22) of dual image photoresist over the material; exposing the dual image photoresist to radiation so as to form at least first and second regions (22A, 22B, 22C) exhibiting different development characteristics; developing the first region (22A) so as to expose a portion of the material; removing the exposed portion of the material so as to define the position of one of the conductive line or stud; developing the second region to expose more of the material; and removing the newly exposed portion of material so as to define the position of the other of the conductive line (16 min /18 min ) or stud (20 min ).

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