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公开(公告)号：DE3379316D1
公开(公告)日：1989-04-06
申请号：DE3379316
申请日：1983-10-26
Applicant: IBM
Inventor： GREENSPAN STEPHEN BARRY , GUPTA OMKARNATH
Abstract: A cooling system is described for modules on electronic circuit cards, the system typically containing a multiplicity of cards. Improved cooling is achieved due to improved boundary layer conditions established by counter air flow in opposite directions on opposite sides of the cards.
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