公开(公告)号：US3524497A

公开(公告)日：1970-08-18

申请号：US3524497D

申请日：1968-04-04

Applicant: IBM

Inventor： CHU RICHARD C ,  COHEN MARTIN G ,  GUPTA OMKARNATH

IPC: H01L23/473 ,  H05K7/20 ,  F28F7/00 ,  H01L1/12

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  Y10S165/903 ,  H01L2924/00

公开(公告)号：DE3379316D1

公开(公告)日：1989-04-06

申请号：DE3379316

申请日：1983-10-26

Applicant: IBM

Inventor： GREENSPAN STEPHEN BARRY ,  GUPTA OMKARNATH

IPC: F28F3/08 ,  F28F13/00 ,  G12B15/04 ,  H01L23/36 ,  H05K7/20

Abstract: A cooling system is described for modules on electronic circuit cards, the system typically containing a multiplicity of cards. Improved cooling is achieved due to improved boundary layer conditions established by counter air flow in opposite directions on opposite sides of the cards.