公开(公告)号：DE3466135D1

公开(公告)日：1987-10-15

申请号：DE3466135

申请日：1984-10-16

Applicant: IBM

Inventor： BEDNORZ JOHANNES GEORG DR ,  GUERET PIERRE LEOPOLD DR ,  NIEVERGELT HERMANN EMIL ,  OTT HANSPETER ,  POHL WOLFGANG DIETER DR ,  WIDMER DANIEL FELIX

IPC: G01R31/26 ,  B25J9/02 ,  C23C14/56 ,  C23F4/00 ,  G12B5/00 ,  H01L21/02 ,  H01L21/677 ,  H01L21/68

公开(公告)号：DE2343441A1

公开(公告)日：1974-04-11

申请号：DE2343441

申请日：1973-08-29

Applicant: IBM

Inventor： GUERET PIERRE LEOPOLD DR

IPC: G11C11/44 ,  H01L39/22

公开(公告)号：DE69114492T2

公开(公告)日：1996-06-20

申请号：DE69114492

申请日：1991-09-05

Applicant: IBM

Inventor： GUERET PIERRE LEOPOLD DR

IPC: G01Q70/06 ,  G01N27/00 ,  G01Q60/16 ,  G01Q70/08 ,  G01Q80/00 ,  G11B9/00 ,  G11B9/08

Abstract: The multiple STM-tip unit comprises a plurality of individually connectable, electrically separated tunnel tips (52...54) arranged in a common sandwiched block (5), in the form of a plurality of electrically conducting layers (41. 46, 50) each associated with at least one of said tunnel tips (52...54) with insulating layers (44, 48) intercalated between said conducting layers (41, 46, 50), the latter each having a contact pad (36, 42, 43) for connection to appertaining electronics. The thickness, area, and material characteristics of said insulating layers (44, 48) are chosen such that the tunnel current through any one of the intercalated insulating layers (44, 48) is negligible with respect to the tunnel current flowing across the gap between the involved tunnel tips (52...54) and the surface with which said tips cooperate. The disclosed method for manufacturing a multiple-tip unit of the kind described above is characterized by the steps of: providing a substrate coated with a layer of soluble resist (31) and a layer of photoresist on top of said resist layer (31); providing at least one hole in said photoresist layer of a size and shape to accommodate the multiple-tip unit structure; providing a first insulating layer (40) to cover the entire bottom area of said hole; depositing a first conducting layer (41) on top of said first insulating layer (40); depositing a second insulating layer (44) through said hole, using a first mask; depositing a second conducting layer (46) on top of said second insulating layer (44), still using said first mask; depositing any further insulating layers (48) and conducting layers (50) as the design of the multiple-tip unit may require, using any further masks as appropriate; dissolving the photoresist to set said block (5) free; and detaching the resulting structure from the substrate by dissolving said resist (31).

公开(公告)号：DE69114492D1

公开(公告)日：1995-12-14

申请号：DE69114492

申请日：1991-09-05

Applicant: IBM

Inventor： GUERET PIERRE LEOPOLD DR

IPC: G01Q70/06 ,  G01N27/00 ,  G01Q60/16 ,  G01Q70/08 ,  G01Q80/00 ,  G11B9/00 ,  G11B9/08

Abstract: The multiple STM-tip unit comprises a plurality of individually connectable, electrically separated tunnel tips (52...54) arranged in a common sandwiched block (5), in the form of a plurality of electrically conducting layers (41. 46, 50) each associated with at least one of said tunnel tips (52...54) with insulating layers (44, 48) intercalated between said conducting layers (41, 46, 50), the latter each having a contact pad (36, 42, 43) for connection to appertaining electronics. The thickness, area, and material characteristics of said insulating layers (44, 48) are chosen such that the tunnel current through any one of the intercalated insulating layers (44, 48) is negligible with respect to the tunnel current flowing across the gap between the involved tunnel tips (52...54) and the surface with which said tips cooperate. The disclosed method for manufacturing a multiple-tip unit of the kind described above is characterized by the steps of: providing a substrate coated with a layer of soluble resist (31) and a layer of photoresist on top of said resist layer (31); providing at least one hole in said photoresist layer of a size and shape to accommodate the multiple-tip unit structure; providing a first insulating layer (40) to cover the entire bottom area of said hole; depositing a first conducting layer (41) on top of said first insulating layer (40); depositing a second insulating layer (44) through said hole, using a first mask; depositing a second conducting layer (46) on top of said second insulating layer (44), still using said first mask; depositing any further insulating layers (48) and conducting layers (50) as the design of the multiple-tip unit may require, using any further masks as appropriate; dissolving the photoresist to set said block (5) free; and detaching the resulting structure from the substrate by dissolving said resist (31).