公开(公告)号：CA1113884A

公开(公告)日：1981-12-08

申请号：CA324920

申请日：1979-04-04

Applicant: IBM

Inventor： HAASE JEROME B ,  THOMPSON JAMES M ,  TOBIN ADRIAN M ,  WICHMANN WILLIAM R

IPC: H01C7/00 ,  B41J2/335 ,  H01L49/00 ,  C23C15/00

Abstract: THIN FILM THERMAL PRINT HEAD A thin film thermal print head is fabricated using radio frequency(rf)or direct current (DC) sputtering within a vacuum chamber into which is introduced a partial pressure of argon and nitrogen. Without breaking the vacuum three consecutive layers comprising respectively tantalum nitride, gold and tantalum nitride are sputter deposited and a diffusion barrier formed on a glazed substrate material. After these steps the desired land patterns are formed by photo lithographic techniques and chemical etching and finally sealant and abrasion resistant coatings are applied.

公开(公告)号：FR2426568A1

公开(公告)日：1979-12-21

申请号：FR7910423

申请日：1979-04-17

Applicant: IBM

Inventor： HAASE JEROME B ,  THOMPSON JAMES M ,  TOBIN ADRIAN M ,  WICHMANN WILLIAM R

IPC: H01C7/00 ,  B41J2/335 ,  H01L49/00 ,  B41J3/20