THIN FILM THERMAL PRINT HEAD
    2.
    发明专利

    公开(公告)号:CA1113884A

    公开(公告)日:1981-12-08

    申请号:CA324920

    申请日:1979-04-04

    Applicant: IBM

    Abstract: THIN FILM THERMAL PRINT HEAD A thin film thermal print head is fabricated using radio frequency(rf)or direct current (DC) sputtering within a vacuum chamber into which is introduced a partial pressure of argon and nitrogen. Without breaking the vacuum three consecutive layers comprising respectively tantalum nitride, gold and tantalum nitride are sputter deposited and a diffusion barrier formed on a glazed substrate material. After these steps the desired land patterns are formed by photo lithographic techniques and chemical etching and finally sealant and abrasion resistant coatings are applied.

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