公开(公告)号：DE69202430T2

公开(公告)日：1996-01-25

申请号：DE69202430

申请日：1992-09-11

Applicant: IBM

Inventor： INTERRANTE MARIO JOHN ,  BERGER MICHAEL ,  HANDFORD EDWARD FRANK ,  TAS EUGENE

IPC: B23K20/10 ,  H01L21/607 ,  H05K3/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00

Abstract: The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.

公开(公告)号：DE69202430D1

公开(公告)日：1995-06-14

申请号：DE69202430

申请日：1992-09-11

Applicant: IBM

Inventor： INTERRANTE MARIO JOHN ,  BERGER MICHAEL ,  HANDFORD EDWARD FRANK ,  TAS EUGENE

IPC: B23K20/10 ,  H01L21/607 ,  H05K3/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00

Abstract: The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.