公开(公告)号：EP1883961A4

公开(公告)日：2012-12-05

申请号：EP06759690

申请日：2006-05-12

Applicant: IBM

Inventor： CASEY JON A ,  BERGER MICHAEL ,  BUCHWALTER LEENA P ,  CANAPERI DONALD F ,  HORTON RAYMOND R ,  JAIN ANURAG ,  PERFECTO ERIC D ,  TORNELLO JAMES A

IPC: H01L23/14 ,  H01L21/48 ,  H01L21/768 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L23/147 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：JPH10245539A

公开(公告)日：1998-09-14

申请号：JP19831797

申请日：1997-07-24

Applicant: IBM

Inventor： BERGER MICHAEL ,  COICO PATRICK A ,  SACHDEV KRISHNA GANDHI ,  POMPEO FRANK L

IPC: C08L79/08 ,  C08G73/10 ,  C09J179/08 ,  C09J183/10 ,  H01L21/52

Abstract: PROBLEM TO BE SOLVED: To obtain a siloxane-containing polyimide adhesive capable of TSM capping with a reduced seal band width in assembling an electronic package and soluble in a solvent friendly to the environment by using an aromatic diether dianhydride, an aromatic diamine having a flexible molecular chain and a polysiloxanediamine. SOLUTION: The composition for forming the adhesive comprises an aromatic diether dianhydride, an aromatic diamine having a flexible molecular chain and a polysiloxanediamine having a vinyl functional group as part of the structure. The molar ratio of the anhydride to the total diamines is about 0.95/1 to 1.05/1, and an excess molar amount of the reactants are capped with a monohydride or a monoamine compound. This composition is polymerized to obtain a siloxane-containing polyimide adhesive. The seal band width is below 4mm.

公开(公告)号：JP2004241771A

公开(公告)日：2004-08-26

申请号：JP2004020523

申请日：2004-01-28

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： CASEY JON A ,  BALZ JAMES G ,  BERGER MICHAEL ,  COHEN JEROME ,  HENDRICKS CHARLES ,  INDYK RICHARD ,  LAPLANTE MARK ,  LONG DAVID C ,  MAIORINO LORI A ,  MERRYMAN ARTHUR G ,  POMERANTZ GLENN A ,  RITA ROBERT A ,  SEMKOW KRYSTYNA W ,  SPENCER PATRICK E ,  SUNDLOF BRIAN R ,  SURPRENANT RICHARD P ,  WALL DONALD R ,  WASSICK THOMAS A ,  WILEY KATHLEEN M

IPC: H05K3/46 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/22

CPC classification number: H05K3/225 ,  H01L21/4846 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/4629 ,  H05K2203/173 ,  Y10T29/49124 ,  Y10T29/49135 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer ceramic correction process which forms a new electric correction path for connecting top vias. SOLUTION: A correction path 65 is provided between a defect net 40 and a redundancy correction net 45 in a multilayer ceramic substrate. The defect net and the correction net are terminated at top vias 41 and 46 of the substrate. The defect net is electrically isolated from an electric correction structure by the use of laser, and a post-burning circuit is formed on and in the substrate. In addition, the passivation of an electric correction line 65 is performed. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：WO2006124607A3

公开(公告)日：2007-04-12

申请号：PCT/US2006018458

申请日：2006-05-12

Applicant: IBM ,  CASEY JON A ,  BERGER MICHAEL ,  BUCHWALTER LEENA P ,  CANAPERI DONALD F ,  HORTON RAYMOND R ,  JAIN ANURAG ,  PERFECTO ERIC D ,  TORNELLO JAMES A

Inventor： CASEY JON A ,  BERGER MICHAEL ,  BUCHWALTER LEENA P ,  CANAPERI DONALD F ,  HORTON RAYMOND R ,  JAIN ANURAG ,  PERFECTO ERIC D ,  TORNELLO JAMES A

IPC: H01L23/22 ,  H01L23/04 ,  H01L23/14 ,  H01L23/24

CPC classification number: H01L23/147 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via (100) at an elevated temperature, A supply chamber (630) is introduced to administer the polymeric material at an elevated temperature, typically at a temperature high enough to liquefy the polymeric material. The polymeric material is introduced through heated supply lines under force from a pump, piston, or a vacuum held within said supply chamber.

Abstract translation: 使用无粘性，低粘度，高温稳定的聚合物或低粘度的高固含量聚合物溶液密封通孔，其中聚合物材料在高温下浸渍在通孔（100）内，引入供应室（630） 以在升高的温度下施用聚合物材料，通常在高至足以液化聚合物材料的温度下。 聚合物材料通过来自泵，活塞或保持在所述供应室内的真空的力的加热供应管线引入。

公开(公告)号：DE69202430T2

公开(公告)日：1996-01-25

申请号：DE69202430

申请日：1992-09-11

Applicant: IBM

Inventor： INTERRANTE MARIO JOHN ,  BERGER MICHAEL ,  HANDFORD EDWARD FRANK ,  TAS EUGENE

IPC: B23K20/10 ,  H01L21/607 ,  H05K3/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00

Abstract: The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.

公开(公告)号：SG50837A1

公开(公告)日：1998-07-20

申请号：SG1997001778

申请日：1997-05-29

Applicant: IBM

Inventor： BERGER MICHAEL ,  CHACE MARK STEPHEN ,  SACHDEV KRISHNA GANDHI

IPC: C08G59/30 ,  C08G59/62 ,  C09J163/00 ,  H01L21/52 ,  H01L21/58 ,  C09J11/00 ,  H01L23/29

Abstract: The present invention discloses chip (die) bond adhesive formulations preferably comprising a siloxane containing epoxide preferably a diglycidyl ether derivative, an anhydride curing additive which is soluble in the epoxide without the use of a solvent, and, optionally comprising, an oligomeric/polymeric co-additive of the type poly(alkyl-acrylate or - methacrylate), in conjunction with thermal and electrically conductive fillers and conventional co-catalysts used for curing epoxy systems to provide reworkable epoxy adhesives. Also disclosed are adhesive formulations comprising a siloxane containing epoxide and a hydroxybenzophenone curing additive which is soluble in the epoxide without the use of a solvent. The chips can be bonded to the substrate by conventional heating and curing techniques. With epoxy adhesive compositions comprising polyacrylate additives, the die bonded assembly can be reworked by heating the assembly to about 180 DEG C to 250 DEG C removing the chip, and rebonding a new chip on the same surface without any effect on the shear strength for die bonded on to gold, copper, silver or a ceramic die pad. Die shear strength using the adhesives remains unchanged when exposed to thermal shock involving -65 DEG C to +150 DEG C excursions, and HAST test at 130 DEG C /85 percent RH (Relative Humidity) or 85 DEG C/85% RH. A method is also provided for using the adhesives to make electronic component assemblies.

公开(公告)号：CA2489619A1

公开(公告)日：2006-06-07

申请号：CA2489619

申请日：2004-12-07

Applicant: IBM CANADA

Inventor： MCKNIGHT DAVID ,  MUNIR KUSHAL ,  BERGER MICHAEL

Abstract: An improved solution for managing a file system that includes an archive is provided. In particular, a request for a file system operation can be received and performed on an object that is stored in an archive. The file system operation can be received from a first computer and performed on the object on a second computer. Further, an archive manager ca n be included that manages an extensible set of archive handlers. In this case, each archive handler can implement a set of file system operations for archives of a particular archive type.

公开(公告)号：DE69202430D1

公开(公告)日：1995-06-14

申请号：DE69202430

申请日：1992-09-11

Applicant: IBM

Inventor： INTERRANTE MARIO JOHN ,  BERGER MICHAEL ,  HANDFORD EDWARD FRANK ,  TAS EUGENE

IPC: B23K20/10 ,  H01L21/607 ,  H05K3/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00

Abstract: The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.