公开(公告)号：DE3574078D1

公开(公告)日：1989-12-07

申请号：DE3574078

申请日：1985-12-13

Applicant: IBM

Inventor： HAUSE JAMES ROBERT ,  MENDEL ERIC

IPC: H01L21/304 ,  H01L21/306 ,  H01L29/06 ,  H01L21/66 ,  C30B33/00 ,  C30B29/60

Abstract: A semiconductor blank wafer to be used in a final simultaneous polishing step of both wafer surfaces for getting a wafer of superior flatness and surface finish, the wafer having a diametral cross-sectional shape like that of a "dogbone" wherein the wafer is thinner in its medial region than it is in the peripheral region and has rounded edges, this shape resulting from a chemical thinning operation.