公开(公告)号：JPH09191065A

公开(公告)日：1997-07-22

申请号：JP1510797

申请日：1997-01-29

Applicant: IBM

Inventor： HAYASHIDA SUMUTO ,  UMEMOTO KAZUHIRO

IPC: H01L23/28 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce its manufacturing cost and can be kept in its good heat radiation condition for a long period of time. SOLUTION: The device includes a resin-made mold 14, a metallic heat sink 22 embedded into the mold 14 as substantially exposed on its one surface to a surface of the semiconductor device, a pad embedded into the mold 14 and disposed on the other side of the heat sink 22, and a semiconductor element 10 connected to a first surface of the pad where the heat sink 22 is located and to a second surface of the pad opposed to the first surface. A silane coupling agent layer is provided at an interface between the mold 14 and pad and the heat sink 22.

公开(公告)号：JPH0831985A

公开(公告)日：1996-02-02

申请号：JP15316994

申请日：1994-07-05

Applicant: IBM

Inventor： HAYASHIDA SUMUTO ,  UMEMOTO KAZUHIRO

IPC: H01L23/28 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433

Abstract: PURPOSE: To maintain heat dissipation of a semiconductor device in an excellent state while reducing the manufacturing cost for a long term. CONSTITUTION: After a heat sink 22 alkaline degreased followed by a flushing treatment and drying, the heat sink is subjected to hydroxid treatment. Later, a diluted silane coupling agent is given to the heat sink 22 so as to dry the heat sink 22 for providing a layer A of the silane coupling agent on the surface of the heat sink 22. Further, a chip 12 mounted on a die pad 16, a lead frame 18 in the state of being connected to this chip 12 by a wire 20 are put inside a metal mold and the heat sink is placed inside this metal mold for performing a molding process so as to manufacture a semiconductor device 10.