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    Multilayer circuit board
    1.
    发明专利
    Multilayer circuit board 审中-公开
    多层电路板

    公开(公告)号：JP2005129663A

    公开(公告)日：2005-05-19

    申请号：JP2003362361

    申请日：2003-10-22

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： UMEMOTO KAZUHIRO

    IPC: H05K3/34 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K1/11 ,  H05K3/46

    CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10674 ,  Y02P70/611

    Abstract: PROBLEM TO BE SOLVED: To prevent crack generated in the board of a pad electrode resulting from difference in the thermal expansion coefficients between a semiconductor chip and a multilayer board in the multilayer board on which a conductor chip is bonded with the flip-chip bonding method.
    SOLUTION: The electrode pad 22 of the multilayer circuit board corresponding to the electrode located near the external circumference 29 of the semiconductor chip is formed in the longer shape, an aperture 35 of a solder resist 23 is smaller than the longer shape, and the center B of aperture is located (L4) with deviation in the direction 30 at the center of the semiconductor chip more than the center A of the longer shape. Accordingly, in the multilayer circuit board, thermal stress applied to the electrode pad (L3) on the board near the peripheral part of the semiconductor chip to be mounted can be alleviated. As a result, the multilayer circuit board can prevent crack generated in the board 21 of the electrode pad 22 near the peripheral part of the semiconductor chip resulting from difference in the thermal expansion coefficient between the semiconductor chip and multilayer board.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题为了防止由导体芯片接合的多层板中的半导体芯片和多层板之间的热膨胀系数的差异导致的焊盘电极的板上产生的裂纹， 芯片接合方法。 解决方案：与位于半导体芯片的外周29附近的电极对应的多层电路板的电极焊盘22形成为更长的形状，阻焊剂23的孔35小于较长的形状， 并且孔径的中心B位于（L4），其在半导体芯片的中心处的方向30上的偏离比较长形状的中心A更大。 因此，在多层电路基板中，可以减轻施加到待安装的半导体芯片的周边部分上的板上的电极焊盘（L3）的热应力。 结果，由于半导体芯片和多层板之间的热膨胀系数的差异，多层电路板可以防止半导体芯片的周边部分附近的电极焊盘22的基板21产生的裂纹。 版权所有（C）2005，JPO＆NCIPI

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR DEVICE
    2.
    发明专利
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：JP2003243598A

    公开(公告)日：2003-08-29

    申请号：JP2002032293

    申请日：2002-02-08

    Applicant: IBM

    Inventor： UMEMOTO KAZUHIRO ,  YOSHIMURA AKIFUMI

    IPC: H01L23/28 ,  H01L21/56 ,  H01L23/50

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device in which internal destruction caused by a difference in internal thermal stresses of members comprising the semiconductor device does not occur in the resin-sealed semiconductor device in which a die pad is exposed outside a package, and a manufacturing method for the semiconductor device. SOLUTION: The semiconductor device is composed of a die pad 14 for placing a semiconductor chip 12 thereon, a lead frame 16 formed of an inner lead 16a electrically connected with the die pad 14 and the semiconductor chip 12 and an outer lead 16b as an external terminal of a semiconductor device 10, and a sheet metal 18 located at the terminal of the package facing the die pad 14. COPYRIGHT: (C)2003,JPO

    LIQUID CRYSTAL DISPLAY AND TAPE CARRIER FOR LIQUID CRYSTAL DISPLAY DRIVER PACKAGE
    3.
    发明专利
    LIQUID CRYSTAL DISPLAY AND TAPE CARRIER FOR LIQUID CRYSTAL DISPLAY DRIVER PACKAGE 失效

    公开(公告)号：JPH07199207A

    公开(公告)日：1995-08-04

    申请号：JP29644293

    申请日：1993-11-26

    Applicant: IBM

    Inventor： SAKAMOTO KAZUNORI ,  UMEMOTO KAZUHIRO

    IPC: G02F1/1345 ,  G02F1/13 ,  H01L23/498 ,  H05K3/36

    Abstract: PURPOSE: To prevent the damage of an input lead of a tape carrier due to distortion or creases which are caused on a TAB tape by the difference in thermal expansion coefficient between a printed circuit board and an LCD glass substrate with respect to an LCD driver package using the TAB tape carrier. CONSTITUTION: A TAB tape carrier 10 of the LCD driver package which has an input lead 12 connected to a printed circuit board 24, an output lead 14 connected to an LCD glass substrate 26, and a chip 22 is provided with at least a pair of anchor holes 40; and after the LCD driver package is mounted, anchor holes 40 are used to fix the tape carrier 10 to the circuit board 24 with solder or adhesive. By this fixing with anchor holes 40, distortion and creases of the tape are prevented from being propagated to the input lead 12.

    MOLDING DEVICE AND MOLDING METHOD
    5.
    发明专利
    MOLDING DEVICE AND MOLDING METHOD 失效

    公开(公告)号：JP2001127349A

    公开(公告)日：2001-05-11

    申请号：JP30702699

    申请日：1999-10-28

    Applicant: IBM

    Inventor： UMEMOTO KAZUHIRO

    IPC: B29C45/00 ,  B29C45/02 ,  B29C45/14 ,  B29C45/26 ,  B29C45/27 ,  B29L11/00 ,  H01L33/54 ,  H01L33/56 ,  H01L33/00

    Abstract: PROBLEM TO BE SOLVED: To provide a mold device and a molding method whereby voids and bubbles are not generated and a weld does not remain in an obtained molded item when an optical semiconductor element is molded with a molding resin. SOLUTION: A molding device 10 comprises a cavity 12 formed of a die with a top force and a bottom force for molding a molded item having a projection part locally and a gate 14 for injecting mold resin to the cavity 12. The molding device 10 is constituted by comprising a gate 30 for a recessed part for injecting mold resin to the cavity 12 comprising a recessed part 22 for molding a portion including a projection part of a molded item and a plate-like gate 28 for injecting mold resin to the cavity 12 for molding a portion without a projection part of a molded item like a plate.

    SEMICONDUCTOR DEVICE
    6.
    发明专利
    SEMICONDUCTOR DEVICE 失效

    公开(公告)号：JPH09191065A

    公开(公告)日：1997-07-22

    申请号：JP1510797

    申请日：1997-01-29

    Applicant: IBM

    Inventor： HAYASHIDA SUMUTO ,  UMEMOTO KAZUHIRO

    IPC: H01L23/28 ,  H01L23/29 ,  H01L23/31

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce its manufacturing cost and can be kept in its good heat radiation condition for a long period of time. SOLUTION: The device includes a resin-made mold 14, a metallic heat sink 22 embedded into the mold 14 as substantially exposed on its one surface to a surface of the semiconductor device, a pad embedded into the mold 14 and disposed on the other side of the heat sink 22, and a semiconductor element 10 connected to a first surface of the pad where the heat sink 22 is located and to a second surface of the pad opposed to the first surface. A silane coupling agent layer is provided at an interface between the mold 14 and pad and the heat sink 22.

    SEMICONDUCTOR DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE
    7.
    发明专利
    SEMICONDUCTOR DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE 失效

    公开(公告)号：JPH0831985A

    公开(公告)日：1996-02-02

    申请号：JP15316994

    申请日：1994-07-05

    Applicant: IBM

    Inventor： HAYASHIDA SUMUTO ,  UMEMOTO KAZUHIRO

    IPC: H01L23/28 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433

    Abstract: PURPOSE: To maintain heat dissipation of a semiconductor device in an excellent state while reducing the manufacturing cost for a long term. CONSTITUTION: After a heat sink 22 alkaline degreased followed by a flushing treatment and drying, the heat sink is subjected to hydroxid treatment. Later, a diluted silane coupling agent is given to the heat sink 22 so as to dry the heat sink 22 for providing a layer A of the silane coupling agent on the surface of the heat sink 22. Further, a chip 12 mounted on a die pad 16, a lead frame 18 in the state of being connected to this chip 12 by a wire 20 are put inside a metal mold and the heat sink is placed inside this metal mold for performing a molding process so as to manufacture a semiconductor device 10.

    A SEMICONDUCTOR PACKAGING WITH AN IMPROVED ADHESION OF THE HEAT SINK TO THE MOLD FOR PACKAGING
    9.
    发明专利
    A SEMICONDUCTOR PACKAGING WITH AN IMPROVED ADHESION OF THE HEAT SINK TO THE MOLD FOR PACKAGING 未知

    公开(公告)号：MY130161A

    公开(公告)日：2007-06-29

    申请号：MYPI9500813

    申请日：1995-03-30

    Applicant: IBM

    Inventor： HAYASHIDA SUMITO ,  UMEMOTO KAZUHIRO

    IPC: H01L23/02 ,  H01L23/28 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433

    Abstract: THE SURFACE OF A HEAT SINK (22) IS HYDROXYLATED BY IMMERSING THE HEAT SINK (22) IN ALKALI SOLUTION, CLEANING WITH WATER AND DRYING. THEREAFTER, A DILUTED SILANE COUPLING AGENT IS APPLIED TO THE SURFACE OF THE HEAT SINK (22), AND THE HEAT SINK (22) IS DRIED, FORMING A LAYER (A) OF THE SILANE COUPLING AGENT ON THE SURFACE OF THE HEAT SINK (22). THEN, A CHIP (12) CARRIED BY THE DIE PAD (16) AND LEAD FRAMES (18), CONNECTED TO THE CHIP (12) WITH WIRES (20) ARE PLACED IN A MOULDING DIE. THE HEAT SINK (22) IS ALSO PLACED IN THE SAME DIE. THE SYSTEM IS THEN CAST IN A MOULD RESIN TO FORM A SEMICONDUCTOR PACKAGE (10).(FIG. 1)

    Semiconductor package with heat sink
    10.
    发明专利
    Semiconductor package with heat sink 未知

    公开(公告)号：SG72596A1

    公开(公告)日：2000-05-23

    申请号：SG1995000358

    申请日：1995-04-28

    Applicant: IBM

    Inventor： UMEMOTO KAZUHIRO ,  HAYASHIDA SUMITO

    IPC: H01L23/28 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L23/42

    Abstract: A heat sink 22 is hydroxulated by degreasing with alkali, cleaning with water and drying, Thereafter, a diluted silane coupling agent is applied to the surface of the heat sink 22, and the heat sink 22 is dried to form a layer A of the silane coupling agent on the surface of the heat sink 22, Then, a chip 12 carried by the die pad 16 and lead frames 18 connected to the chip 12 with wires 20 are placed in the die, the heat sink 22 is placed in the same die, and the system is moulded to form a semiconductor packaging 10. In this manner, heat dissipation characteristics are maintained while reducing manufacturing costs.

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