公开(公告)号：US3879840A

公开(公告)日：1975-04-29

申请号：US31157872

申请日：1972-12-04

Applicant: IBM

Inventor： AMES IRVING ,  D HEURLE FRANCOIS M ,  HORSTMANN RICHARD E

IPC: H01B1/00 ,  H01B1/02 ,  H01L21/00 ,  H01L23/29 ,  H01L23/485 ,  H01L27/00 ,  B01J17/00

CPC classification number: H01L23/485 ,  H01B1/00 ,  H01B1/023 ,  H01L21/00 ,  H01L23/291 ,  H01L24/45 ,  H01L27/00 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/14 ,  Y10S148/02 ,  Y10S257/904 ,  Y10S438/927 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752

Abstract: This disclosure provides a copper doped aluminum conductive thin film stripe for use as a current-carrying member in a solid state microelectronic configuration which has substantial resistance against circuit failure due to damage caused by current-induced mass transport in the stripe. It has also been discovered for the practice of this invention that the addition of a relatively small amount of copper to an aluminum stripe together with a suitable heat-treatment enhances the extent of its lifetime during current conduction. Preferably, the percentage copper is from the neighborhood of 0.1 percent to the neighborhood of 10 percent by weight composition of copper in the aluminum and with an annealing heat-treatment in the approximate range of 250* to 560*C. However, for certain operational conditions of the stripe a selected percent less than 54 percent copper by weight composition is advantageous.

Abstract translation: 本公开内容提供了一种用作固态微电子结构中的载流元件的铜掺杂铝导电薄膜条纹，其具有对由于条纹中的电流引起的质量传输引起的损坏导致的电路故障的显着阻力。 对于本发明的实践也已经发现，通过适当的热处理将相对少量的铜加到铝条上，在电流传导期间增加其寿命的程度。 优选地，铜的百分比从铝的0.1％附近到邻近的10重量％的铜组成，并且在大约250℃至560℃的范围内进行退火热处理。然而，对于某些操作 条纹条件选择百分比小于54重量％的铜组成是有利的。