公开(公告)号：DE112020005819T5

公开(公告)日：2022-11-03

申请号：DE112020005819

申请日：2020-11-23

Applicant: IBM

Inventor： STEINMACHER-BUROW BURKHARD ,  HUELS HARALD

IPC: H04L41/0895

Abstract: Ein durch einen Computer realisiertes Verfahren umfasst Empfangen einer Indexnummer für jede aus einer Mehrzahl von physischen Verarbeitungseinheiten, wobei jede der Mehrzahl von physischen Verarbeitungseinheiten in einer Leaf-Spine-Topologie zum Datenaustausch mit jedem aus einer Mehrzahl von Switch-Chips verbunden ist; Zuweisen mindestens einer der Mehrzahl von physischen Verarbeitungseinheiten zu einem ersten virtuellen Einschub durch Aktualisieren eines Eintrags in einer Tabelle virtueller Einschübe, welcher eine Zuordnung zwischen der entsprechenden Indexnummer der mindestens einen physischen Verarbeitungseinheit und einem Index des ersten virtuellen Einschubs anzeigt; und Ausführen einer Einschubverwaltungsfunktion auf Grundlage der Tabelle virtueller Einschübe.

公开(公告)号：GB2463538B

公开(公告)日：2012-04-25

申请号：GB0905032

申请日：2009-03-25

Applicant: IBM

Inventor： STAIGER DIETER ,  HUELS HARALD

IPC: H05K7/20 ,  G06F1/20

公开(公告)号：GB2459751A

公开(公告)日：2009-11-11

申请号：GB0905031

申请日：2009-03-25

Applicant: IBM

Inventor： STAIGER DIETER ,  HUELS HARALD

IPC: G06F1/18

Abstract: A primary printed circuit board (100) is electrically coupled to at least one subsystem (180), such as a memory subsystem (180), such as DIMM, wherein the subsystem (180) comprises at least one subsystem module (220) plugged into a connector (218). The subsystem (180) is fully self contained and is arranged on at least one separate subsystem board (210) electrically connected to the primary printed circuit board (100). A thermal link system may be provided to direct heat to one or more dedicated inner layers or the housing, using a flow of cooling fluid and may use heat pipes and/or vapour chambers. The board portions may be perpendicular and connected using a third flexible board portion. The first board area may consist of signal intergrity-sensitive electrical wiring and connected to the second area provided for memory support electronics. Memory subsystems may be symmetrically placed on either side or juxtaposed at the centre of the memory block to create a subsystem block. The subsystem block may be stacked.

公开(公告)号：GB2459752A

公开(公告)日：2009-11-11

申请号：GB0905058

申请日：2009-03-25

Applicant: IBM

Inventor： STAIGER DIETER ,  HUELS HARALD

IPC: H05K1/02 ,  G11C5/00 ,  H05K1/18

Abstract: Memory board (210) for a computer system (50), wherein one or more connectors (218) for one or more memory modules (220) are attached to the memory board (210), comprising - a first dedicated board area (222) provided for electrical wiring mainly consisting of signal-integrity-sensitive electrical wiring which electrically connects the one or more connectors (218); and a second dedicated board area (230) provided for memory support electronics (232, 234, 236, 238). The first and second board areas are provided respectively on a first and second board portion. - A third flexible board portion arranged between first and second board portions for connecting these portions. - The first and second board portions are arranged perpendicular to each other.

公开(公告)号：GB2459752B

公开(公告)日：2012-06-27

申请号：GB0905058

申请日：2009-03-25

Applicant: IBM

Inventor： STAIGER DIETER ,  HUELS HARALD

IPC: H05K1/02 ,  G11C5/00 ,  H05K1/18

公开(公告)号：GB2463538A

公开(公告)日：2010-03-24

申请号：GB0905032

申请日：2009-03-25

Applicant: IBM

Inventor： STAIGER DIETER ,  HUELS HARALD

IPC: H05K7/20 ,  G06F1/20

Abstract: A thermal link system 300 for a computer system, such as blade or rack server (figs 1-3), has a subsystem 180 of primary printed circuit board 100, which has at least one subsystem board 210 which carries one or more subsystem modules 220, such as a stack of DIMM memory modules 220, connected to the subboard. Thermal link elements 310, 312, 314, 316 extract heat from the DIMM modules towards at least one thermal interface, such as 304 which connects to dedicated inner layers 104 of the primary board (100) and/or interface 320 which connects to the system housing 150. The thermal elements 312, 310 preferably support the memory modules 220 and thus the sub-boards 210 via connectors 218. The thermal elements may comprise heat-pipes( fig 9).