公开(公告)号：JPH1174243A

公开(公告)日：1999-03-16

申请号：JP19132798

申请日：1998-07-07

Applicant: IBM

Inventor： HUYNH CUC ,  JAGANNATHAN RANGARAJAN ,  JHA AMARNATH ,  MARTIN THOMAS ,  POPE KEITH ,  SANDWICK THOMAS

IPC: H01L21/304 ,  C11D7/32 ,  C11D7/50 ,  C11D11/00 ,  H01L21/306

Abstract: PROBLEM TO BE SOLVED: To enable efficient removal of residual slurry in chemical and mechanical polishing with semiconductor by using a solution of trialkanolamine as a cleaning agent. SOLUTION: A solution of trialkanolamine expressed by the formula is used in the stage of polishing a semiconductor wafer. In the formula, n is an integer from 2-8. Trialkanolamine contained in the formula includes, for example, triethanolamine, tripropanolamine, and tributanolamine but triethanolamie(TEA) is preferable. If necessary, the polished wafer may be immersed in a solution of TEA in the stage of unload station. Triethanolamie can be used as a solution with a concentration such that pH reaches up to approx. 10, however, it may be used with a concentration the range of 0.001%-5% in the unload station of a polisher.

公开(公告)号：DE19824046B4

公开(公告)日：2007-08-30

申请号：DE19824046

申请日：1998-05-29

Applicant: IBM

Inventor： HUYNH CUC ,  JAGANNATHAN RANGARAJAN ,  JHA AMARNATH ,  MARTIN THOMAS ,  POPE KEITH ,  SANDWICK THOMAS

IPC: H01L21/304 ,  B08B3/08 ,  C07C215/08 ,  C09G1/02 ,  C11D7/32 ,  C11D7/50 ,  C11D11/00 ,  C23G3/00 ,  C23G5/036 ,  H01L21/306

Abstract: A CMP semiconductor wafer planarization method is provided employing an aqueous solution of a trialkanol amine as a wafer cleaning solution. Wafers are produced exhibiting a substantial reduction in semiconductor device failures as shown by a significant decrease in m1-m1 (metal to metal) shorts.

公开(公告)号：DE19824046A1

公开(公告)日：1999-01-14

申请号：DE19824046

申请日：1998-05-29

Applicant: IBM

Inventor： HUYNH CUC ,  JAGANNATHAN RANGARAJAN ,  JHA AMARNATH ,  MARTIN THOMAS ,  POPE KEITH ,  SANDWICK THOMAS

IPC: H01L21/304 ,  C11D7/32 ,  C11D7/50 ,  C11D11/00 ,  H01L21/306 ,  C23G5/036 ,  C23G3/00 ,  C07C215/08 ,  C09G1/02 ,  B08B3/08

Abstract: Removal of emulsion from semiconductor wafers in a chemical-mechanical polishing (CMP) process uses an aqueous solution of a trialkanolamine (I) for cleaning. Also claimed is a CMP wafer planarisation process using a colloidal suspension containing alumina during polishing and a cleaning solution containing (I) during or after polishing.