-
公开(公告)号：CA2160501A1
公开(公告)日：1996-05-22
申请号：CA2160501
申请日：1995-10-13
Applicant: IBM
Inventor： FRANKENY JEROME ALBERT , FRANKENY RICHARD FRANCIS , IMKEN RONALD LANN , VANDERLEE KEITH ALLAN
Abstract: Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. In one respect, the invention relates to the fabrication of board layers by beginning with a metallic core, patterning the core, selectively enclosing the core in a dielectric, selectively depositing metal to form vias, plugs and signal lines, and forming dendrites with joining metallurgy on the vias and plugs to provide stackable connection from above or below the plane of the board layer. In another aspect, the invention is directed to the use of a sol-gel process to form a thin high dielectric constant crystalline film onto a metallic sheet followed with a deposition of a metallic layer onto the high dielectric constant film. The film serves as the dielectric of a capacitor layer which is thereafter in succession patterned, covered by a dielectric, and has selectively deposited a metallic layer for interconnecting the capacitor and forming vias. The ends of the vias are thereafter subject to dendritic growth and joining metallurgy to provide stackable interconnection capability. A multilayer composite laminar stackable circuit board structure is created using, as appropriate, layers having metallic cores and layers having capacitively configured cores. The multilayer laminar stackable circuit board provides direct vertical connection between surface mounted electronic components and the power, signal and capacitive decoupling layers of the composite board through the dendrites and joining metallurgy of the via and plug formations.
-
公开(公告)号：BR9002103A
公开(公告)日：1991-08-13
申请号：BR9002103
申请日：1990-05-04
Applicant: IBM
Inventor： FRANKENY RICHARD FRANCIS , HAJ-ALI-AHMADI JAVED , IMKEN RONALD LANN , WUSTRAU ROLF
IPC: H01R13/193 , H01R12/88 , H01R24/00 , H05K7/14 , H01R9/09
Abstract: A system for providing low insertion force electrical interconnections between high density contacts for use in interconnecting circuit packages. A housing has disposed therein one or more pre-buckled beam connectors. Each connector has a resilient insulating strip carrying a plurality of buckling beams electrically isolated from each other. The beams are aligned on the plane defining the strip in parallel with ends extending away from the strip edges in opposing directions. Means are provided for deforming the strip within the housing prior to effecting desired interconnections whereby the beams are pre-buckled. Upon urging contacts into proximity with the beam ends, the buckling force is released causing each beam's ends to be urged away from the strip into engagement with respective contacts, thereby effecting desired interconnection between contacts and through one or more beams.
-
公开(公告)号：BR9002101A
公开(公告)日：1991-08-13
申请号：BR9002101
申请日：1990-05-04
Applicant: IBM
-
公开(公告)号：DE69020428D1
公开(公告)日：1995-08-03
申请号：DE69020428
申请日：1990-04-24
Applicant: IBM
-
公开(公告)号：DE69106225D1
公开(公告)日：1995-02-09
申请号：DE69106225
申请日：1991-05-20
Applicant: IBM
Inventor： FRANKENY JEROME ALBERT , FRANKENY RICHARD FRANCIS , HERMANN KARL , IMKEN RONALD LANN
IPC: H01L21/60 , H01L21/66 , H01L23/14 , H01L23/373 , H01L23/498 , H05K1/00 , H05K3/42 , H05K3/44 , H05K3/36
-
Patent Agency Ranking
公开(公告)号：DE69010397D1
公开(公告)日：1994-08-11
申请号：DE69010397
申请日：1990-04-23
Applicant: IBM
Inventor： ARLDT BRIAN DUDLEY , FRANKENY RICHARD FRANCIS , HAJ-ALI-AHMADI JAVAD , IMKEN RONALD LANN , WUSTRAU ROLF
IPC: H01R13/193 , H01R12/88 , H01R24/00 , H05K7/14 , H01R23/72
Abstract: A system for providing low insertion force electrical interconnections between high density contacts for use in interconnecting circuit packages. A housing has disposed therein one or more pre-buckled beam connectors. Each connector has a resilient insulating strip carrying a plurality of buckling beams electrically isolated from each other. The beams are aligned on the plane defining the strip in parallel with ends extending away from the strip edges in opposing directions. Means are provided for deforming the strip within the housing prior to effecting desired interconnections whereby the beams are pre-buckled. Upon urging contacts into proximity with the beam ends, the buckling force is released causing each beam's ends to be urged away from the strip into engagement with respective contacts, thereby effecting desired interconnection between contacts and through one or more beams.
-
公开(公告)号：CA2160501C
公开(公告)日：2001-01-16
申请号：CA2160501
申请日：1995-10-13
Applicant: IBM
Inventor： FRANKENY JEROME ALBERT , FRANKENY RICHARD FRANCIS , IMKEN RONALD LANN , VANDERLEE KEITH ALLAN
Abstract: Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. In one respect, the invention relates to the fabrication of board layers by beginning with a metallic core, patterning the core, selectively enclosing the core in a dielectric, selectively depositing metal to form vias, plugs and signal lines, and forming dendrites with joining metallurgy on the vias and plugs to provide stackable connection from above or below the plane of the board layer. In another aspect, the invention is directed to the use of a sol-gel process to form a thin high dielectric constant crystalline film onto a metallic sheet followed with a deposition of a metallic layer onto the high dielectric constant film. The film serves as the dielectric of a capacitor layer which is thereafter in succession patterned, covered by a dielectric, and has selectively deposited a metallic layer for interconnecting the capacitor and forming vias. The ends of the vias are thereafter subject to dendritic growth and joining metallurgy to provide stackable interconnection capability. A multilayer composite laminar stackable circuit board structure is created using, as appropriate, layers having metallic cores and layers having capacitively configured cores. The multilayer laminar stackable circuit board provides direct vertical connection between surface mounted electronic components and the power, signal and capacitive decoupling layers of the composite board through the dendrites and joining metallurgy of the via and plug formations.
-
公开(公告)号：SG52149A1
公开(公告)日：1998-09-28
申请号：SG1995000517
申请日：1995-05-25
Applicant: IBM
Inventor： RICE JANET LOUISE , FRANKENY JEROME ALBERT , FRANKENY RICHARD FRANCIS , IMKEN RONALD LANN , HAYDEN TERRY FREDERICK
Abstract: Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. In one respect, the invention relates to the fabrication of board layers by beginning with a metallic core, patterning the core, selectively enclosing the core in a dielectric, selectively depositing metal to form vias, plugs and signal lines, and forming dendrites with joining metallurgy on the vias and plugs to provide stackable connection from above or below the plane of the board layer. In another aspect, the invention is directed to the use of a sol-gel process to form a thin high dielectric constant crystalline film onto a metallic sheet followed with a deposition of a metallic layer onto the high dielectric constant film. The film serves as the dielectric of a capacitor layer which is thereafter in succession patterned, covered by a dielectric, and has selectively deposited a metallic layer for interconnecting the capacitor and forming vias. The ends of the vias are thereafter subject to dendritic growth and joining metallurgy to provide stackable interconnection capability. A multilayer composite laminar stackable circuit board structure is created using, as appropriate, layers having metallic cores and layers having capacitively configured cores. The multilayer laminar stackable circuit board provides direct vertical connection between surface mounted electronic components and the power, signal and capacitive decoupling layers of the composite board through the dendrites and joining metallurgy of the via and plug formations.
-
公开(公告)号：BR9400335A
公开(公告)日：1994-08-16
申请号：BR9400335
申请日：1994-01-26
Applicant: IBM
Inventor： FRANKENY JEROME ALBERT , FRANKENY RICHARD FRANCIS , HERMANN KARL , IMKEN RONALD LANN
Abstract: Discrete computational elements are provided that will be connected to a base unit, and to one another or I/O devices, in order to configure a particular computer system. The base unit provides the electrical power required to energize the computational elements. A plurality of identically configured substrates are joined in a layered relation and are electrically connected with one another. These substrates are capable of being fabricated of different lengths such that they can extend outwardly from the computational element and may be connected to other computational elements. At least one integrated circuit will be placed on one side of the joined substrates and is electrically connected to each substrate layer. In this manner the ICs will be able to communicate with chips on other computational elements. A support member is also included that stiffens the plural substrate layers and independently distributes electrical power through voltage and ground potential planes, and interconnected substrate layers, to the chips. The support member will be disposed adjacent the substrate layers on a side opposite the ICs and independently attachable to the base unit by using electrical connection pins, a pluggable lip portion, or the like.
-
公开(公告)号：BR9504582A
公开(公告)日：1997-10-07
申请号：BR9504582
申请日：1995-10-27
Applicant: IBM
Inventor： FRANKENY JEROME ALBERT , FRANKENY RICHARD FRANCIS , HAYDEN TERRY FREDERICK , IMKEN RONALD LANN , RICE JANET LOUISE
Abstract: Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. In one respect, the invention relates to the fabrication of board layers by beginning with a metallic core, patterning the core, selectively enclosing the core in a dielectric, selectively depositing metal to form vias, plugs and signal lines, and forming dendrites with joining metallurgy on the vias and plugs to provide stackable connection from above or below the plane of the board layer. In another aspect, the invention is directed to the use of a sol-gel process to form a thin high dielectric constant crystalline film onto a metallic sheet followed with a deposition of a metallic layer onto the high dielectric constant film. The film serves as the dielectric of a capacitor layer which is thereafter in succession patterned, covered by a dielectric, and has selectively deposited a metallic layer for interconnecting the capacitor and forming vias. The ends of the vias are thereafter subject to dendritic growth and joining metallurgy to provide stackable interconnection capability. A multilayer composite laminar stackable circuit board structure is created using, as appropriate, layers having metallic cores and layers having capacitively configured cores. The multilayer laminar stackable circuit board provides direct vertical connection between surface mounted electronic components and the power, signal and capacitive decoupling layers of the composite board through the dendrites and joining metallurgy of the via and plug formations.
-
-
-
-
-
-
-
-
-
Search Results
15
records
(took 0.051 seconds)
