公开(公告)号：GB2345790A

公开(公告)日：2000-07-19

申请号：GB9927378

申请日：1999-11-22

Applicant: IBM

Inventor： MCGAHAY VINCENT JAMES ,  IVERS THOMAS HENRY ,  NYE HENRY ,  LIU JOYCE

IPC: H01L21/3205 ,  H01L21/28 ,  H01L21/768 ,  H01L23/52 ,  H01L23/532

Abstract: Poorly adherent layers 5 such as silicon nitride and silicon dioxide exhibit improved adhesion to a copper member 1 by providing an intervening germanium-containing layer 3. The germanium-containing layer is copper germanide, germanium oxide, germanium nitride or combinations thereof. The germanium-containing layer enhances the adhesion such that the poorly adherent layer is less susceptible to delamination from the copper member.

公开(公告)号：GB2345790B

公开(公告)日：2003-12-10

申请号：GB9927378

申请日：1999-11-22

Applicant: IBM

Inventor： MCGAHAY VINCENT JAMES ,  IVERS THOMAS HENRY ,  NYE HENRY ,  LIU JOYCE C

IPC: H01L21/3205 ,  H01L21/28 ,  H01L21/768 ,  H01L23/52 ,  H01L23/532

Abstract: Poorly adherent layers such as silicon nitride and silicon dioxide exhibit improved adhesion to copper member by providing an intervening germanium-containing layer. The germanium-containing layer is copper germanide, germanium oxide, germanium nitride or combinations thereof. The germanium-containing layer enhances the adhesion such that the poorly adherent layer is less susceptible to delamination from the copper member.