公开(公告)号：SG60206A1

公开(公告)日：1999-02-22

申请号：SG1998000429

申请日：1998-02-26

Applicant: IBM

Inventor： ARMEZZANI GREGG JOSEPH ,  IVES ROBERT NICHOLAS ,  PIERSON AMRK VINCENT ,  TULL TERRY ALAN

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K1/14

Abstract: An electronic package is provided that includes a flexible polyimide film carrier having electronic circuitry on both of its major surfaces and a plurality of solder interconnection pads on a first major surface; solder mask layers located on both major surfaces, provided that areas between subsequently to be applied individual circuit chips on the first major surface exist that are free from the solder mask; and a plurality of modules attached to the film carrier by the solder balls or bumps. Also provided is a method for fabricating the electronic package that includes reflow of the solder balls or bumps to achieve attachment of the modules.

公开(公告)号：MY118146A

公开(公告)日：2004-09-30

申请号：MYPI9800773

申请日：1998-02-23

Applicant: IBM

Inventor： ARMEZZANI GREGG JOSEPH ,  IVES ROBERT NICHOLAS ,  PIERSON MARK VINCENT ,  TULL TERRY ALAN

IPC: H05K1/14 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34

Abstract: AN ELECTRONIC PACKAGE IS PROVIDED THAT INCLUDES A FLEXIBLE POLYIMIDE FILM CARRIER HAVING ELECTRONIC CIRCUITRY ON BOTH OF ITS MAJOR SURFACES AND A PLURALITY OF SOLDER INTERCONNECTION PADS ON A FIRST MAJOR SURFACE; SOLDER MASK LAYERS LOCATED ON BOTH MAJOR SURFACES, PROVIDED THAT AREAS BETWEEN SUBSEQUENTLY TO BE APPLIED INDIVIDUAL CIRCUIT CHIPS ON THE FIRST MAJOR SURFACE EXIST THAT ARE FREE FROM THE SOLDER MASK; AND A PLURALITY OF MODULES ATTACHED TO THE FILM CARRIER BY THE SOLDER BALLS OR BUMPS. ALSO PROVIDED IS A METHOD FOR FABRICATING THE ELECTRONIC PACKAGE THAT INCLUDES REFLOW OF THE SOLDER BALLS OR BUMPS TO ACHIEVE ATTACHMENT OF THE MODULES. (FIGURE 1)