公开(公告)号：JPH1041458A

公开(公告)日：1998-02-13

申请号：JP5901397

申请日：1997-03-13

Applicant: IBM

Inventor： STEPHEN H BALDEMAN ,  JAMES M NEBER

IPC: H01L25/00 ,  H01L23/60 ,  H01L25/04 ,  H01L25/18

Abstract: PROBLEM TO BE SOLVED: To provide an ESD(electrostatic discharge) protection circuit and other buffer circuits such as decoupling capacitors, drivers and receivers, without occupying large areas on a core integrated circuit chip. SOLUTION: A package is composed of a complementary metal oxide semiconductor(CMOS) core integrated circuit ship 20, a support ship 22 and a lead 34 for external connection. The support ship 22 is provided with an ESD protection circuit and lead buffer circuits such as a decoupling capacitor, a driver and a receiver, for electrical connection with the core integrated circuit chip 20 and the leas 34. The yield and performance of a core integrated ship are improved by shifting the lead buffer circuits from the core ship and providing them on other support chips.