公开(公告)号：GB2605234A

公开(公告)日：2022-09-28

申请号：GB202116911

申请日：2021-11-24

Applicant: IBM

Inventor： HONGQING ZHANG ,  JAY A BUNT ,  SHIDONG LI ,  ZHIGANG SONG ,  GUODA LIAN ,  JUNJUN LI

IPC: H05K1/02 ,  G06F21/86

Abstract: Tamper-respondent assembly including circuit board 610, electronic component 602 and enclosure assembly 620 coupled to circuit board 610 to enclose electronic component 602 within a secure volume 601. Enclosure assembly 620 includes an enclosure with a sealed inner compartment 623 containing a structural material 701. Structural material 701 inhibits deflection of the enclosure due to a pressure differential between the sealed inner compartment 623 and around the enclosure 620. Pressure sensor 640 sense pressure within sealed inner compartment 623 to facilitate identification of a pressure change indicative of a tamper event. Optionally, structural material 701 may comprise a foam metal with interconnected pores. Enclosure 620 may comprise a metal enclosure with inner and outer walls. Foam metal within the sealed inner compartment 623 may be diffusion bonded to these walls. Sealed inner compartment 623 may comprise two sealed inner chambers of differing pressures, both containing structural material 701. A monitor circuit may be positioned within secure volume 601 to monitor the pressure of sealed inner compartment 623 via pressure sensor 640.

公开(公告)号：GB2601628A

公开(公告)日：2022-06-08

申请号：GB202115785

申请日：2021-11-03

Applicant: IBM

Inventor： DAVID J LEWISON ,  JAY A BUNT ,  FRANK L POMPEO ,  RICHARD WALTER OLDREY ,  JOHN D SYLVESTRI ,  PHONG T TRAN

IPC: H01L21/82 ,  H01L21/02 ,  H01L23/367

Abstract: A method of preparing a computer processor die comprising determining warpage shape of the die at a testing temperature and from this, contouring a thickness of the die at a contouring temperature by physically removing material from a surface of the die such that said surface will be substantially flat at the testing temperature. The surface is contacted with a cooling plate. The testing temperature may lie within 10°C of the operating temperature of the die. Finite element analysis may be used iteratively to determine the contouring that should be performed for the surface of the die to be substantially flat. Another method is provided comprising: heating the die to an initial temperature, attaching the die to a shaping material to maintain the shape at said temperature, contouring a thickness of the die and separating the die from the shaping material. Said shaping material may be wax and may be poured between a stud and the die and allowed to solidify, dry and/or cure.