Tamper-respondant assembly with structural material within sealed inner compartment

    公开(公告)号:GB2605234A

    公开(公告)日:2022-09-28

    申请号:GB202116911

    申请日:2021-11-24

    Applicant: IBM

    Abstract: Tamper-respondent assembly including circuit board 610, electronic component 602 and enclosure assembly 620 coupled to circuit board 610 to enclose electronic component 602 within a secure volume 601. Enclosure assembly 620 includes an enclosure with a sealed inner compartment 623 containing a structural material 701. Structural material 701 inhibits deflection of the enclosure due to a pressure differential between the sealed inner compartment 623 and around the enclosure 620. Pressure sensor 640 sense pressure within sealed inner compartment 623 to facilitate identification of a pressure change indicative of a tamper event. Optionally, structural material 701 may comprise a foam metal with interconnected pores. Enclosure 620 may comprise a metal enclosure with inner and outer walls. Foam metal within the sealed inner compartment 623 may be diffusion bonded to these walls. Sealed inner compartment 623 may comprise two sealed inner chambers of differing pressures, both containing structural material 701. A monitor circuit may be positioned within secure volume 601 to monitor the pressure of sealed inner compartment 623 via pressure sensor 640.

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