公开(公告)号：JPH0615564A

公开(公告)日：1994-01-25

申请号：JP11151793

申请日：1993-05-13

Applicant: IBM

Inventor： JIEEMUZU EDOWAADO KIYARII ,  RONARUDO NOOMAN SHIYURUTSU ,  ADAMU DAN CHITSUKUNOA

IPC: B23Q3/08 ,  B24B37/30 ,  H01L21/304 ,  B24B37/04

Abstract: PURPOSE: To provide a wafer polishing jig comprising a first liquid film confined by a non-porous but flexible enclosure, and for uniformly dispersing polishing force applied to the surface of a wafer supported with the confined liquid. CONSTITUTION: This jig comprises a non-porous and flexible template having a pocket 5 reciving a wafer 7 to be polished. A washer is placed between the template pocket and a carrier 3. A water film fills the lower part of the pocket, and it is confined with the aid of the washer and by an overlying porous pad 9 extending across the pocket and having a non-porous sheath 8 facing the liquid. A second liquid film saturates and covers the upper surface of the pad. The wafer 7 to be polished floats upon the second liquid film within the pocket 5.