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公开(公告)号:HK1025183A1
公开(公告)日:2000-11-03
申请号:HK00104382
申请日:2000-07-18
Applicant: IBM
Inventor: APPELT BERND KARL , JOHANSSON GARY ALAN , PAPATHOMAS KONSTANTINOS I
Abstract: An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads.
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公开(公告)号:MY133136A
公开(公告)日:2007-10-31
申请号:MYPI9902398
申请日:1999-06-11
Applicant: IBM
Inventor: APPELT BERND KARL , JOHANSSON GARY ALAN , PAPATHOMAS KONSTANTINOS I
Abstract: AN ORGANIC CHIP CARRIER HAVING CIRCUITRY AND WIRE BOND PADS THEREON IS BONDED TO AN INTEGRATED CIRCUIT DIE BY A PHOTOCURABLE ADHESIVE AND IS ELECTRICALLY CONNECTED THEREWITH BY WIRE BONDING TO THE WIRE BOND PADS.
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