公开(公告)号：HK1025183A1

公开(公告)日：2000-11-03

申请号：HK00104382

申请日：2000-07-18

Applicant: IBM

Inventor： APPELT BERND KARL ,  JOHANSSON GARY ALAN ,  PAPATHOMAS KONSTANTINOS I

IPC: H01L21/60 ,  H01L21/52 ,  H01L21/58 ,  H01L21/607 ,  H01L ,  C09J

Abstract: An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads.

公开(公告)号：MY133136A

公开(公告)日：2007-10-31

申请号：MYPI9902398

申请日：1999-06-11

Applicant: IBM

Inventor： APPELT BERND KARL ,  JOHANSSON GARY ALAN ,  PAPATHOMAS KONSTANTINOS I

IPC: H01L21/60 ,  H01L23/48 ,  B32B33/00 ,  H01L21/52 ,  H01L21/58 ,  H01L21/607 ,  H01L23/52 ,  H01L29/40

Abstract: AN ORGANIC CHIP CARRIER HAVING CIRCUITRY AND WIRE BOND PADS THEREON IS BONDED TO AN INTEGRATED CIRCUIT DIE BY A PHOTOCURABLE ADHESIVE AND IS ELECTRICALLY CONNECTED THEREWITH BY WIRE BONDING TO THE WIRE BOND PADS.