Method for forming silicon-on-insulator transistor of deep junction
    2.
    发明专利
    Method for forming silicon-on-insulator transistor of deep junction 审中-公开
    形成深度绝缘子晶体管的方法

    公开(公告)号:JP2007294950A

    公开(公告)日:2007-11-08

    申请号:JP2007103478

    申请日:2007-04-11

    CPC classification number: H01L27/1203 H01L21/823814

    Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a transistor device with a dopant depth which is extended and increased so as to have no effect on a channel region of a transistor.
    SOLUTION: The method comprises: (a) a step of providing a substrate comprising a semiconductor-on-insulator structure ("SOI") layer separated from a bulk region in the substrate by an embedded dielectric layer; (b) a step of performing a first implantation to the SOI layer in order to attain a predetermined concentration of dopant in an interface of the SOI layer to the embedded dielectric layer; and (c) a step of performing a second implantation to the SOI layer in order to attain a predetermined concentration of dopant in a polycrystalline semiconductor gate conductor ("poly gate") as well as in a source region and a drain region which are arranged to be adjacent to the poly gate. The maximum depth of the first implantation is deeper than the maximum depth of the second implantation.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种用于形成具有扩展和增加的掺杂剂深度的晶体管器件的方法,以便对晶体管的沟道区域没有影响。 解决方案:该方法包括:(a)提供包括绝缘体上半导体结构(“SOI”)层的衬底的步骤,该衬底通过嵌入的电介质层与衬底中的本体区域分离; (b)为了在SOI层与嵌入介电层的界面中获得预定浓度的掺杂剂,对SOI层进行第一次注入的步骤; 以及(c)为了在多晶半导体栅极导体(“多晶硅”)以及源极区和漏极区中排列的多个半导体栅极导体(“多晶硅”)以及源极区和漏极区域中的掺杂剂浓度达到预定浓度,对SOI层进行第二注入的步骤 与多门相邻。 第一植入的最大深度比第二植入的最大深度更深。 版权所有(C)2008,JPO&INPIT

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