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1.Solder method for providing standoff of device from substrate 失效
Title translation: 用于从衬底提供器件对接的焊接方法公开(公告)号:US3392442A
公开(公告)日:1968-07-16
申请号:US46662565
申请日:1965-06-24
Applicant: IBM
Inventor: JOHN NAPIER , ROSS JR RUPERT F
IPC: B23K1/19 , H01L21/60 , H01L23/485 , H05K3/34
CPC classification number: H05K3/3436 , B23K1/19 , H01L23/485 , H01L24/81 , H01L2224/13111 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/0105 , H01L2924/01052 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H05K2201/09472 , H05K2201/09509 , H05K2203/041 , Y02P70/613 , Y10T29/49144
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公开(公告)号:CH447300A
公开(公告)日:1967-11-30
申请号:CH87967
申请日:1967-01-20
Applicant: IBM
Inventor: JOHN NAPIER , RAEMAN PAUL SOPHER , PAUL ANTHONY TOTTA , DAVID DEWITT , CLARENCE KARAN
IPC: H01L21/00 , H01L21/60 , H01L23/485 , H01R12/55 , H03K3/34
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