公开(公告)号：FR2316699A1

公开(公告)日：1977-01-28

申请号：FR7611976

申请日：1976-04-16

Applicant: IBM

Inventor： BARRETT GERALD G ,  HORNUNG LOUIS M ,  JONES CALVIN C JR

IPC: G11C11/14 ,  G11C19/08 ,  G11C29/00

Abstract: 1526474 Testing and repairing magnetic bubble chips INTERNATIONAL BUSINESS MACHINES CORP 26 April 1976 [30 June 1975] 16807/76 Addition to 1482998 Heading H3B In a modification of Specification 1,482,998, a series of magnetic bubble register loops is tested and repaired by propagating a chain of scout bubbles through the loops, detecting the chain to sense the occurrence of bubble voids indicative of defective loops, and loading the complementary sensed pattern into repair stations S (one at each loop) to cause the defective loop(s) to be bypassed A. Bubbles loaded onto discs D are replaced by the scout chain via pulsed conductor 22, propagate through the store and are magnetoresistively sensed, after which the complementary scout pattern replaces the original chain which is then destroyed.