公开(公告)号：MY128103A

公开(公告)日：2007-01-31

申请号：MYPI9802016

申请日：1998-05-06

Applicant: IBM

Inventor： KAN SUNG KWON ,  PURUSHOTHAMAN SAMPATH ,  RAI RAJINDER SINGH

IPC: H01B1/22 ,  B23K1/20 ,  B23K35/24 ,  H01L21/60

Abstract: WHAT IS DESCRIBED IS NEW ELECTRODEPOSITED POWDER MATERIALS TO BE USED FOR THE ELECTRICALLY CONDUCTIVE PASTE FORMULATIONS, IN SEVERAL TYPES OF THEIR STRUCTURES AS FOLLOWS: ELECTRODEPOSITED POWDER CONSISTING OF SN(UNDERCOAT)/CU(DENDRITE)/SN(BARRIER)/IN(OVERCOAT.THE SN (BARRIER) LAYER CAN BE REPLACED BY ONE OF THE FOLLOWING METALS AND THEIR ALLOYS; Sn, Ni, Co, Cr, Fe, AND Pd.THE UNDERCOAT SN LAYER CAN BE REPLACED BY ONE OF THE FOLLOWING METALS AND THEIR ALLOYS; Sn IN, Zn, Sb, Bi AND Ag. ELECTRODEPOSITED POWDER CONSISTING OF Sn (UNDERCOAT)/CU(DENDRITE)/Bi-Sn (OVERCOAT).WHAT IS ADDITIONALLY CLAIMED IS THE USAGE OF THIS ELECTRODEPOSITED POWDER MATERIALS TO MAKE FILLED POLYMER PASTES FOR MAKING CONDUCTING LINES, GROUND PLANES, AND VIA FILLS IN THE CONVENTIONAL PRINTED CIRCUIT BOARDS BY REPLACING EITHER THE ADDITIVE OR SUBTRACTIVE CU TECHNOLOGY. THIS WILL FACILITATE THE ELIMINATION OF PROCESS STEPS AND CHEMICALS THUS REDUCING COST AND THE ENVIRONMENTAL IMPACT ASSOCIATED WITH PRINTED CIRCUIT BOARD MANUFACTURING. IT IS ALSO CLAIMED THAT THE PASTE CAN BE USED TO ATTACH ELECTRONIC COMPONENTS SUCH AS CHIPS AND CHIP CARRIER TAPES TO SUBSTRATES SUCH AS CHIP CARRIERS THAT PANEL DISPLAY GLASS AND PRINTED WIRING BOARDS.(FIG. 5)