公开(公告)号：JPH1065056A

公开(公告)日：1998-03-06

申请号：JP16725697

申请日：1997-06-24

Applicant: IBM

Inventor： PETER GEOFFREY BUROFUMAN ,  BARARAMU GOOSARU ,  KATHLEEN AN RIDESUTORI ,  RAYMOND ALAN JACKSON ,  CARL J PATORITSUTSU ,  WILLIAM EDWARD SABURINSUKI

IPC: H01L23/12 ,  B23K3/06 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide an electronic component with a socket-type bump grid array including a forming solder covering metal ball. SOLUTION: This method includes an operation for positioning a covering metal ball 16 in a positioning device 17 with a plurality of openings 20 corresponding to an array, a conical base part is located on the upper surface for the openings 20, and a taper 19 is preferably made in the shape of a truncated cone with a longer diameter than that of the solder covering metal ball 16. The openings 20 are constituted so that one portion of the ball positioned in the openings is extended toward the upper portion of the upper surface of the aligning device 17. Then, when a pad 12 of a substrate 11 is brought into contact with the positioned ball 16 and solder 14 is subjected to reflow, a bond is formed between the metal ball and a conductive layer on the substrate and the shape of the aligning device 17 is taken and solder covers the entire surface of the metal ball.