公开(公告)号：JP2000340712A

公开(公告)日：2000-12-08

申请号：JP2000109574

申请日：2000-04-11

Applicant: IBM

Inventor： INTERRANTE MARIO J ,  RAYMOND ALAN JACKSON ,  SUDEIPUTA KUMAA RAY ,  PAUL A ZUKKO ,  SCOTT R DWYER

IPC: H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To mechanically stabilize column grid wires on a substrate by coating column grid array wires with a polymer of low glass-transition temperature on a substrate, after their mounting. SOLUTION: A standard ceramic wire column grid array, which is to be mounted on a substrate is used to which a thin polymer coating 50 is added, in such a way as to cover fillets of a wire column 32. The polymer 50, having proper coating and temperature characteristics, is applicable to distributed or spin coating in order to obtain a thin conformed coating on fillets of the wire column 32. The substrate 30 is generally made of ceramic, but an organic substrate or a silicon substrate may be used, if satisfactory adhesion of the polymer can be made. The glass transition temperature of the polymer 50, at which the polymer softens, is lower than the melting point of a lead/tin alloy used to form the wire column 32. The polymer 50 adheres to the ceramic substrate 30 and to the lower side of a metal pad 34, and causes the wire column 32 to adhere to the surface of the lead/tin alloy solder.

公开(公告)号：JPH1065056A

公开(公告)日：1998-03-06

申请号：JP16725697

申请日：1997-06-24

Applicant: IBM

Inventor： PETER GEOFFREY BUROFUMAN ,  BARARAMU GOOSARU ,  KATHLEEN AN RIDESUTORI ,  RAYMOND ALAN JACKSON ,  CARL J PATORITSUTSU ,  WILLIAM EDWARD SABURINSUKI

IPC: H01L23/12 ,  B23K3/06 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide an electronic component with a socket-type bump grid array including a forming solder covering metal ball. SOLUTION: This method includes an operation for positioning a covering metal ball 16 in a positioning device 17 with a plurality of openings 20 corresponding to an array, a conical base part is located on the upper surface for the openings 20, and a taper 19 is preferably made in the shape of a truncated cone with a longer diameter than that of the solder covering metal ball 16. The openings 20 are constituted so that one portion of the ball positioned in the openings is extended toward the upper portion of the upper surface of the aligning device 17. Then, when a pad 12 of a substrate 11 is brought into contact with the positioned ball 16 and solder 14 is subjected to reflow, a bond is formed between the metal ball and a conductive layer on the substrate and the shape of the aligning device 17 is taken and solder covers the entire surface of the metal ball.