公开(公告)号：JP2000223819A

公开(公告)日：2000-08-11

申请号：JP2000006956

申请日：2000-01-14

Applicant: IBM

Inventor： PETER JEFFREY ,  SHAJII FAULK ,  KNICKERBOCKER JOHN U ,  SCOTT AIRA RANZENTAARU ,  SUDEIPITA KUMER ROY ,  KATHRYN ANN SATARUTAA

IPC: B23K1/00 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H05K3/24 ,  H05K3/30 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a method for assembling an electronic module equipped with an improved solder interconnection part by overcoming the nonflatness of electronic constituent elements. SOLUTION: A chip 20 has a conic solder joint part 26 and a trapezoidal solder joint part 36. A coining tool 30 having a heating coil 32 has a cavity 34 for forming part of a solder preform in a conic shape. The cavity 37 is formed in the conic shape so as to coin the solder preform in a truncated-cone shape. The truncated-cone shaped solder preform which is thus obtained stands off while an electronic module is assembled so as to control the breakage of the conic solder preform. The solder preform is adaptive to the opposite surface of a chip or substrate at different height, so it is adaptive to nonflatness that the surfaces of the chip and substrate typically have.