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公开(公告)号:FR2310067A1
公开(公告)日:1976-11-26
申请号:FR7608560
申请日:1976-03-12
Applicant: IBM
Inventor: HOFFMANN ARTHUR R , KENDALL ARTHUR H , QPRO ROHR ROBERT L
IPC: C03B23/047 , C03B23/04 , B41J3/04
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公开(公告)号:CA1191679A
公开(公告)日:1985-08-13
申请号:CA424285
申请日:1983-03-23
Applicant: IBM
Inventor: KENDALL ARTHUR H , ROHR ROBERT L , SHAFER MERRILL W
Abstract: CORROSION-RESISTANT CONDUCTIVE GLASS Alkali resistant high melting point glass containing about 15% - 20% zirconium dioxide forms an optimum composite structure with 1 to 6 parts glass frit to 1 to 2 parts ruthenium dioxide when fired at 800 to 1000.degree.C.
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公开(公告)号:CA1079787A
公开(公告)日:1980-06-17
申请号:CA270283
申请日:1977-01-24
Applicant: IBM
Inventor: KENDALL ARTHUR H , ROHR ROBERT L
Abstract: PRE-AIMED NOZZLE FOR INK JET RECORDER AND METHOD OF MANUFACTURE of The Disclosure A pre-aimed nozzle device comprises a nozzle block with an orifice wafer attached thereto. The nozzle block has an aiming surface. The orifice wafer comprises an annular orifice element retained in the body of the wafer in a manner whereby the orifice element and wafer are bonded-to the nozzle block with the opening of the orifice element perpendicular to the aiming surface. The orifice wafer is made by encapsulating a straight section of glass tubing in a block of ceramic. The block is machined with precision external location surfaces. A groove is machined into the block with internal location surfaces parallel with the external location surfaces. After potting of the tube in the groove with solder glass, the wafer block is cut along planes perpendicular to the external location surfaces to obtain annular orifice elements precisely aimed relative to the wafer body.
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公开(公告)号:CA1102137A
公开(公告)日:1981-06-02
申请号:CA267509
申请日:1976-12-09
Applicant: IBM
Inventor: HOFFMAN ARTHUR R , KENDALL ARTHUR H , ROHR ROBERT L
Abstract: Multiple nozzle arrays are formed from an assembly of at least one pair of plates having intersecting channels for receiving orifice clements and sealant. In the preferred assembly, one plate has a single channel for carrying a plurality of orifice elements and a plurality of deeper, parallel cross-channels for carrying the sealant, and the other plate has a similar set of sealant-carrying cross-channels that connect when the plates are joined. In another embodiment only one plate is machined with intersecting channels of different depth, the shallow channels for carrying the orifice elements and the deep channels for carrying the sealant, the second plate serving only as a cover. The joined plates, with inserted orifice elements and sealant, are then mounted vertically (preferred embodiment) or at an appropriate angle and exposed to a temperature sufficient to cause the sealant alone to melt and to flow by capillary and gravity action to seal the orifice elements in a void-and-bubble free manner and to seal the plates to form a plate block. After gradual cooling, the plate block is sliced into multiple nozzle wafers, which are then lapped and polished and mounted on a back-up plate for attachment to a source of high pressure fluid.
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公开(公告)号:FR2334500A1
公开(公告)日:1977-07-08
申请号:FR7634518
申请日:1976-11-08
Applicant: IBM
Inventor: HOFFMAN ARTHUR R , KENDALL ARTHUR H , ROHR ROBERT L
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