中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.017 seconds)

    Article surface treating apparatus and method
    1.
    发明授权
    Article surface treating apparatus and method 失效
    文章表面处理装置和方法

    公开(公告)号：US3577278A

    公开(公告)日：1971-05-04

    申请号：US3577278D

    申请日：1968-12-23

    Applicant: IBM

    Inventor： ROHR ROBERT L

    IPC: B08B3/02 ,  C23G3/00 ,  C23G5/04 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306

    CPC classification number: C23G5/04 ,  C23G3/00 ,  H01L21/00

    Abstract: AN ARTICLE SURFACE TREATING APPARATUS IS DESCRIBED HEREIN IN WHICH AN ARTICLE HOLDER HAVING A PLURALITY OF ARTICLES MOUNTED THEREON IS BUOYANTLY DISPOSED IN A TANK CONTAINING A FLUID. THE ARTICLE HOLDER IS CONTINUOUSLY CAUSED TO ROTATE BY A STREAM OF A LIQUID SOLUTION IMPINGING THEREON, SO AS TO CAUSE THE SUCCESSIVE SURFACE TREATMENT OF THE ARTICLES. THE ARTICLES MAY BE SUBJECTED TO A PROCESS, E.G. (CLEANING AND RINSING OR ETCHING AND RINSING) WHEREIN SEVERAL SOLUTIONS MAY BE PROGRAMMED TO SERIALLY TREAT THE SURFACES OF THE PLURALITY OF ARTICLES.

    MULTIPLE NOZZLE ARRAYS AND METHOD OF MANUFACTURE
    3.
    发明专利
    MULTIPLE NOZZLE ARRAYS AND METHOD OF MANUFACTURE 未知

    公开(公告)号：CA1102137A

    公开(公告)日：1981-06-02

    申请号：CA267509

    申请日：1976-12-09

    Applicant: IBM

    Inventor： HOFFMAN ARTHUR R ,  KENDALL ARTHUR H ,  ROHR ROBERT L

    IPC: B05B1/14 ,  B41J2/135 ,  B41J2/16 ,  C03B23/20 ,  C03C27/10 ,  H04N1/034 ,  B41J3/04

    Abstract: Multiple nozzle arrays are formed from an assembly of at least one pair of plates having intersecting channels for receiving orifice clements and sealant. In the preferred assembly, one plate has a single channel for carrying a plurality of orifice elements and a plurality of deeper, parallel cross-channels for carrying the sealant, and the other plate has a similar set of sealant-carrying cross-channels that connect when the plates are joined. In another embodiment only one plate is machined with intersecting channels of different depth, the shallow channels for carrying the orifice elements and the deep channels for carrying the sealant, the second plate serving only as a cover. The joined plates, with inserted orifice elements and sealant, are then mounted vertically (preferred embodiment) or at an appropriate angle and exposed to a temperature sufficient to cause the sealant alone to melt and to flow by capillary and gravity action to seal the orifice elements in a void-and-bubble free manner and to seal the plates to form a plate block. After gradual cooling, the plate block is sliced into multiple nozzle wafers, which are then lapped and polished and mounted on a back-up plate for attachment to a source of high pressure fluid.

    PRE-AIMED NOZZLE FOR INK JET RECORDER AND METHOD OF MANUFACTURE
    7.
    发明专利
    PRE-AIMED NOZZLE FOR INK JET RECORDER AND METHOD OF MANUFACTURE 未知

    公开(公告)号：CA1079787A

    公开(公告)日：1980-06-17

    申请号：CA270283

    申请日：1977-01-24

    Applicant: IBM

    Inventor： KENDALL ARTHUR H ,  ROHR ROBERT L

    IPC: B41J2/16 ,  G01D15/18 ,  B41J3/04 ,  G01D15/16

    Abstract: PRE-AIMED NOZZLE FOR INK JET RECORDER AND METHOD OF MANUFACTURE of The Disclosure A pre-aimed nozzle device comprises a nozzle block with an orifice wafer attached thereto. The nozzle block has an aiming surface. The orifice wafer comprises an annular orifice element retained in the body of the wafer in a manner whereby the orifice element and wafer are bonded-to the nozzle block with the opening of the orifice element perpendicular to the aiming surface. The orifice wafer is made by encapsulating a straight section of glass tubing in a block of ceramic. The block is machined with precision external location surfaces. A groove is machined into the block with internal location surfaces parallel with the external location surfaces. After potting of the tube in the groove with solder glass, the wafer block is cut along planes perpendicular to the external location surfaces to obtain annular orifice elements precisely aimed relative to the wafer body.

    PRECISION CUTTING APPARATUS AND METHOD OF OPERATION THEREFOR
    8.
    发明专利
    PRECISION CUTTING APPARATUS AND METHOD OF OPERATION THEREFOR 未知

    公开(公告)号：CA953210A

    公开(公告)日：1974-08-20

    申请号：CA100732

    申请日：1970-12-16

    Applicant: IBM

    Inventor： GRANDIA JOHANNES ,  ROHR ROBERT L

    IPC: B26D1/553 ,  B26D1/547 ,  B28D5/04 ,  H01L21/301

    Abstract: A precision cutting apparatus including a cutting tool which consists of at least a single flexible cutting element and means coacting with said cutting element for holding it in a rigid, unstressed condition is disclosed. The flexible cutting element is ordinary spring steel while the means for holding the cutting element in a rigid, unstressed condition is a block of dimensionally-stable pyrolytic graphite containing a groove in which the spring steel cutting element is receivable. Also disclosed, is translation means for applying rectilinear motion to the cutting tool, and a means for aligning the work piece relative to the cutting tool. The grooved graphite block, in addition to providing a dimensionally stable holder, also provides a porous material into which an adhesive may be introduced to retain the cutting element within the grooves. Heating the graphite block liquefies an appropriate adhesive and permits the removal of an old cutting element and its replacement with a new cutting element. A method of operating the cutting apparatus is also shown including an alignment step which permits extremely precise cutting. The apparatus and method taught have particular utility in the semiconductor area where the ability to dice with great precision, for example, greatly enhances the yield of usable semiconductor chips.

Patent Agency Ranking