-
公开(公告)号：DE3070125D1
公开(公告)日：1985-03-21
申请号：DE3070125
申请日：1980-10-29
Applicant: IBM
Inventor： ANDROS FRANK EDWARD , KERJILIAN GHAZAROS KRIKOR , STEVENS BERT EDGAR
IPC: H05K7/20
Abstract: Metallized ceramic (MC) modules (25), which are mounted on printed circuit cards (24), and multi-layer ceramic (MLC) modules (17), which are mounted on a printed circuit planar board (11), are combined into one hybrid package. An air cooling distribution system is provided wherein air is first caused to impinge against the MLC modules (17) after which it is directed to flow serially across the MC modules (25).
Search Results
1
records
(took 0.016 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
