公开(公告)号：HK1011499A1

公开(公告)日：1999-07-09

申请号：HK98112233

申请日：1998-11-24

Applicant: IBM

Inventor： ANDROS FRANK EDWARD ,  BUPP JAMES RUSSELL ,  DIPIETRO MICHAEL ,  HAMMER RICHARD BENJAMIN

IPC: H01L21/607 ,  H01L23/12 ,  H01L23/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H05K

Abstract: An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

公开(公告)号：DE3070125D1

公开(公告)日：1985-03-21

申请号：DE3070125

申请日：1980-10-29

Applicant: IBM

Inventor： ANDROS FRANK EDWARD ,  KERJILIAN GHAZAROS KRIKOR ,  STEVENS BERT EDGAR

IPC: H05K7/20

Abstract: Metallized ceramic (MC) modules (25), which are mounted on printed circuit cards (24), and multi-layer ceramic (MLC) modules (17), which are mounted on a printed circuit planar board (11), are combined into one hybrid package. An air cooling distribution system is provided wherein air is first caused to impinge against the MLC modules (17) after which it is directed to flow serially across the MC modules (25).

公开(公告)号：GB2286084B

公开(公告)日：1998-01-14

申请号：GB9500965

申请日：1995-01-18

Applicant: IBM

Inventor： ANDROS FRANK EDWARD ,  BUPP JAMES RUSSELL ,  DIPIETRO MICHAEL ,  HAMMER RICHARD BENJAMIN

IPC: H01L21/607 ,  H01L23/14 ,  H01L23/31 ,  H01L23/12 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H05K7/20 ,  H05K1/18 ,  H05K3/34

Abstract: An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

公开(公告)号：DE2963197D1

公开(公告)日：1982-08-12

申请号：DE2963197

申请日：1979-12-10

Applicant: IBM

Inventor： ANDROS FRANK EDWARD ,  SHAY ROBERT JOHN EUGENE

IPC: F28D15/02 ,  F28D15/06 ,  H01L23/427 ,  H01L23/433 ,  H01L23/42

Abstract: A closed two phase liquid-vapor heat transfer device is provided which is independent of orientation and requires no wick. A micro bellows containment vessel is filled with liquid to form a coolant vapor phase bubble which is centered within the vessel due to the surface energy characteristics of the fluid. Heat input at the evaporator section results in evaporation of the liquid at the liquid-vapor interface. The vapor flows across the bubble and condenses on the opposite side where heat is rejected and liquid is replenished to the evaporator section by flow through the continuous liquid film.

公开(公告)号：GB2286084A

公开(公告)日：1995-08-02

申请号：GB9500965

申请日：1995-01-18

Applicant: IBM

Inventor： ANDROS FRANK EDWARD ,  BUPP JAMES RUSSELL ,  DIPIETRO MICHAEL ,  HAMMER RICHARD BENJAMIN

IPC: H01L21/607 ,  H01L23/14 ,  H01L23/31 ,  H01L23/12 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H05K7/20 ,  H05K1/18 ,  H05K3/34

Abstract: An electronic package includes a rigid support member 31, e.g. a copper sheet, to which is bonded both the packager's semiconductor chip 41 and a circuitized substrate 15. The chip 41 is bonded using a thermally conductive adhesive 53 while the circuitized substrate 15, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip 41 is electrically coupled to designated parts of the circuitry of the substrate 15, preferably by wire, 49, thermocompression or thermosonic bonding. An encapsulant 51 may be used to cover and protect the connections between the chip 41 and substrate 15. This package may in turn be electrically coupled to a separate, second substrate 27 such as a PCB.

公开(公告)号：IT1165401B

公开(公告)日：1987-04-22

申请号：IT2823979

申请日：1979-12-20

Applicant: IBM

Inventor： ANDROS FRANK EDWARD ,  SHAY ROBERT JOHN

IPC: F28D15/02 ,  F28D15/06 ,  H01L23/427 ,  H01L23/433

Abstract: A closed two phase liquid-vapor heat transfer device is provided which is independent of orientation and requires no wick. A micro bellows containment vessel is filled with liquid to form a coolant vapor phase bubble which is centered within the vessel due to the surface energy characteristics of the fluid. Heat input at the evaporator section results in evaporation of the liquid at the liquid-vapor interface. The vapor flows across the bubble and condenses on the opposite side where heat is rejected and liquid is replenished to the evaporator section by flow through the continuous liquid film.

公开(公告)号：DE3063183D1

公开(公告)日：1983-06-16

申请号：DE3063183

申请日：1980-11-18

Applicant: IBM

Inventor： ANDROS FRANK EDWARD ,  SHAY ROBERT JOHN EUGENE

IPC: F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  F28D15/00 ,  H01L23/42

Abstract: A closed two phase liquid-vapor heat transfer device is provided which is independent of orientation and requires no wick. A micro helix containment vessel contains liquid to form a coolant vapor phase. Heat input at the evaporator section results in evaporation of the liquid at the liquid-vapor interface. The vapor flows through the bellow and condenses on the opposite end where heat is rejected and liquid is replenished to the evaporator section by flow through capillary passages of helical form in the corrugations of the bellows.