1.
    发明专利
    未知

    公开(公告)号:DE69024379T2

    公开(公告)日:1996-07-18

    申请号:DE69024379

    申请日:1990-01-25

    Applicant: IBM

    Abstract: A thin film metal alloy magnetic recording disk has an improved protective overcoat which is both wear resistant and which creates a low level of stiction in a rigid disk file. In a preferred embodiment the overcoat is a film of essentially amorphous carbon or hydrogen-containing carbon with relatively small amounts of additives of iron (Fe), tungsten (W) or tungsten-carbide (WC). The structure of the overcoat is a relatively smooth planar carbon surface with discrete clusters of the additives which project slightly above the smooth carbon surface. The specific additives to the carbon overcoat improve the wear resistance of the disk and permit the sliders to contact the disks in contact start/stop (CSS) operation without damage to any of the disk file components.

    2.
    发明专利
    未知

    公开(公告)号:DE69024379D1

    公开(公告)日:1996-02-08

    申请号:DE69024379

    申请日:1990-01-25

    Applicant: IBM

    Abstract: A thin film metal alloy magnetic recording disk has an improved protective overcoat which is both wear resistant and which creates a low level of stiction in a rigid disk file. In a preferred embodiment the overcoat is a film of essentially amorphous carbon or hydrogen-containing carbon with relatively small amounts of additives of iron (Fe), tungsten (W) or tungsten-carbide (WC). The structure of the overcoat is a relatively smooth planar carbon surface with discrete clusters of the additives which project slightly above the smooth carbon surface. The specific additives to the carbon overcoat improve the wear resistance of the disk and permit the sliders to contact the disks in contact start/stop (CSS) operation without damage to any of the disk file components.

    INTEGRATED CIRCUIT RESISTOR STRUCTURE

    公开(公告)号:DE3367486D1

    公开(公告)日:1986-12-11

    申请号:DE3367486

    申请日:1983-07-04

    Applicant: IBM

    Inventor: KIM KWANG KON

    Abstract: A minimal corrosion resistor structure and deposition technique for superconductive circuits, with mutually protective niobium oxide passivation ring, gold corrosion barrier film and titanium resistive layer. Niobium has an intrinsic oxide of Nb 2 O 5 , which must be removed from a contact area designated by an opening in photoresist; the development process leaves a photoresist overhang. The gold corrosion barrier film deposition is sharply focused to form an area corresponding to the opening in the photoresist. An unfocused plasma oxidation step, which follows the gold deposition, grows an extrinsic Nb 2 0 5 passivation ring about the gold. The titanium resistive metal is then deposited with a wider focus than that of the gold corrosion barrier film, through the same opening, the titanium resistive metal layer deposits over the edge of the gold, encapsulating the gold with a diffusion barrier.

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