公开(公告)号：DE3568931D1

公开(公告)日：1989-04-20

申请号：DE3568931

申请日：1985-06-03

Applicant: IBM

Inventor： BHATT ANILKUMAR CHINUPRASAD ,  DORAN DONALD EDWARD ,  KNIGHT JAMES WALLACE

IPC: B32B15/08 ,  B32B5/08 ,  B32B15/14 ,  B32B17/04 ,  D03D1/00 ,  D03D15/00 ,  D03D15/12 ,  H05K1/03

Abstract: A material for printed circuits is disclosed. The material consists of woven glass fiber cloth in which the warp is of plied yarn (12) and the fill is of unplied or twisted yarn (13) to facilitate more thorough polymeric resin impregnation and achieve improved dimensional stability.

公开(公告)号：DE3476628D1

公开(公告)日：1989-03-09

申请号：DE3476628

申请日：1984-12-11

Applicant: IBM

Inventor： BHATT ANILKUMAR CHINUPRASAD ,  CIBULSKY MICHAEL JOSEPH ,  DORAN DONALD EDWARD ,  HUGABOOM LAWRENCE JAMES ,  KNIGHT JAMES WALLACE

IPC: D03D1/00 ,  D03D15/00 ,  D03D15/12 ,  H05K1/03

Abstract: A resin-impregnated substrate for printed circuits is disclosed, which substrate comprises a fabric woven from warp and fill yarns of glass filaments. The yarns have substantial the same number of filaments therein and are substantially elliptical in cross section when woven. The transverse axis (26) of the warp yarn (24) cross sections has a length that is at least 75 percent of the length of the transverse axis (27) of the fill yarn (25) cross sections. This ensures a thorough impregnation of the fabric by a resin so that voids (16) are avoided which, when filled with materials other than resin, such as plating solution, ultimately produce circuit failures.