公开(公告)号：US6436803B2

公开(公告)日：2002-08-20

申请号：US84043201

申请日：2001-04-23

Applicant: IBM

Inventor： BHATT ANILKUMAR CHINUPRASAD ,  MAGNUSON ROY HARVEY ,  MILLER THOMAS RICHARD ,  MARKOVICH VOYA RISTA ,  SAMBUCETTI CARLOS J ,  TISDALE STEPHEN LEO

IPC: H05K3/38 ,  C23C18/16 ,  H01L23/12 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K3/18 ,  H05K3/46 ,  H01L21/44

CPC classification number: H05K3/181 ,  C23C18/1632 ,  C23C18/2086 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15312 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A permanent photoimagable dielectric layer is formed over the wiring layer and via holes are formed through the dielectric layer over pads and conductors of the wiring layer. Holes are formed through the substrate and substrate surfaces including the photoimagable dielectric, walls of the via holes, and walls of the through holes subjected to an electroless copper plating process. The process includes seeding the surface, coating the surface with a first solution containing surfactant and electroplating in a second solution in which the level of surfactant is regulated by determining the surface tension and metering surfactant addition to the second solution depending on the determination of surface tension. The copper plating on the photoimagable dielectric is patterned to form an exterior wiring layer which is covered by solder resist with windows over lands around the through holes and surface mount connection pads of the exterior wiring layer to form a high density circuitized substrate. Surface mount components and/or pin in hole components are attached to the circuitized substrate with solder joints between terminals of the components and the lands and/or connection pads to form a high density circuit board assembly. One or more of the circuit board assemblies are mounted in an enclosure with a power supply, CPU, RAM, and I/O means to form an information handling system with increased performance due to shorter signal flight times due to the higher device density.

Abstract translation: 通过形成具有电介质表面的基板并将金属箔层压到基板上来制造电路板。 图案化金属箔以形成第一布线层。 在布线层上方形成永久的光致可变电介质层，并且通过布线层的焊盘和导体上的电介质层形成通孔。 通过基板和基板表面形成孔，包括可光成像的电介质，通孔的壁和穿过无电镀铜工艺的通孔的壁。 该方法包括接种表面，用含有表面活性剂的第一溶液涂覆表面和在第二溶液中电镀，其中通过根据表面张力的测定确定表面张力和计量表面活性剂添加到第二溶液中来调节表面活性剂的含量 。 对可光成像电介质上的镀铜进行图案化以形成外部布线层，该外部布线层由通过孔周围的窗口和外部布线层的表面安装连接焊盘覆盖的阻焊剂覆盖，以形成高密度电路化基板。 表面安装部件和/或销孔部件通过部件的端子与焊盘和/或连接焊盘之间的焊接点附接到电路化的基板，以形成高密度电路板组件。 一个或多个电路板组件安装在具有电源，CPU，RAM和I / O装置的外壳中，由于更高的器件密度，由于更短的信号飞行时间，从而形成具有增加的性能的信息处理系统。

公开(公告)号：DE3568931D1

公开(公告)日：1989-04-20

申请号：DE3568931

申请日：1985-06-03

Applicant: IBM

Inventor： BHATT ANILKUMAR CHINUPRASAD ,  DORAN DONALD EDWARD ,  KNIGHT JAMES WALLACE

IPC: B32B15/08 ,  B32B5/08 ,  B32B15/14 ,  B32B17/04 ,  D03D1/00 ,  D03D15/00 ,  D03D15/12 ,  H05K1/03

Abstract: A material for printed circuits is disclosed. The material consists of woven glass fiber cloth in which the warp is of plied yarn (12) and the fill is of unplied or twisted yarn (13) to facilitate more thorough polymeric resin impregnation and achieve improved dimensional stability.

公开(公告)号：CA2094407C

公开(公告)日：1997-04-08

申请号：CA2094407

申请日：1993-04-20

Applicant: IBM

Inventor： BANTU NAGESHWER RAO ,  BHATT ANILKUMAR CHINUPRASAD ,  KEESLER ROSS WILLIAM ,  PAPATHOMAS KONSTANTINOS ,  SINCLAIR TERRY DONALD ,  WAGNER JEROME JAMES

IPC: B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30 ,  B01D1/00

Abstract: Disclosed is a method of recovering a cyclic alkylene carbonate, such as propylene carbonate, from an effluent stream of a process in which the cyclic alkylene carbonate removes an organic photoresist material from a substrate. The effluent is a cyclic alkylene carbonate effluent, e.g., a propylene carbonate effluent, of the carbonate, water, and polymeric solids. In the recovery process the cyclic alkylene carbonate effluent is fed to a heat exchanger, and separated into (i) water and volatiles, and (ii) cyclic carbonate. This lowers the concentration of water in the cyclic alkylene carbonate to a level that is low enough to substantially avoid hydrolysis of cyclic alkylene carbonate to the corresponding glycol. The dewatered cyclic alkylene carbonate is evaporated to separate the cyclic alkylene carbonate from high boiling materials and polymeric solids. The dewatered cyclic alkylene carbonate is separated into (i) a cyclic alkylene carbonate fraction, and (ii) a photoresist solids fraction. The photoresist materials fractions contains photoresist material in the alkylene carbonate. The cyclic alkylene carbonate fraction is further separated in a fractionation means into a higher vapor pressure alkylene glycol fraction, and a lower vapor pressure alkylene carbonate fraction.

公开(公告)号：DE3476628D1

公开(公告)日：1989-03-09

申请号：DE3476628

申请日：1984-12-11

Applicant: IBM

Inventor： BHATT ANILKUMAR CHINUPRASAD ,  CIBULSKY MICHAEL JOSEPH ,  DORAN DONALD EDWARD ,  HUGABOOM LAWRENCE JAMES ,  KNIGHT JAMES WALLACE

IPC: D03D1/00 ,  D03D15/00 ,  D03D15/12 ,  H05K1/03

Abstract: A resin-impregnated substrate for printed circuits is disclosed, which substrate comprises a fabric woven from warp and fill yarns of glass filaments. The yarns have substantial the same number of filaments therein and are substantially elliptical in cross section when woven. The transverse axis (26) of the warp yarn (24) cross sections has a length that is at least 75 percent of the length of the transverse axis (27) of the fill yarn (25) cross sections. This ensures a thorough impregnation of the fabric by a resin so that voids (16) are avoided which, when filled with materials other than resin, such as plating solution, ultimately produce circuit failures.

公开(公告)号：SG44058A1

公开(公告)日：1997-11-14

申请号：SG1996010841

申请日：1996-10-14

Applicant: IBM

Inventor： BHATT ANILKUMAR CHINUPRASAD ,  BHATT ASHWINKUMAR CHINUPRASAD ,  DAY ROBERT JEFFERY ,  DUFFY THOMAS PATRICK ,  KNIGHT JEFFERY ALAN ,  MALEK RICHARD WILLIAM ,  MARKOVICH VOYA RISTA

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/42 ,  C25D5/02 ,  H05K3/02

Abstract: A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e.g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.

公开(公告)号：SG34252A1

公开(公告)日：1996-12-06

申请号：SG1995001096

申请日：1995-08-11

Applicant: IBM

Inventor： BHATT ANILKUMAR CHINUPRASAD ,  KSENAK GARY STEPHEN ,  PAPATHOMAS KOSTAS I ,  SHURTLEFF JAMES ADAMS ,  WAGNER JEROME JAMES

IPC: G03F7/32 ,  G03F7/42 ,  G03F7/30

Abstract: A method is disclosed for using the simple, environmentally-friendly organic compounds gamma-butyrolactone and benzyl alcohol to develop and to strip free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases the developers and strippers include gamma butyrolactone or benzyl alcohol. The developers and strippers optionally also include a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water. During development of the photopatterned resist or solder mask, the unpolymerized regions are dissolved in the disclosed developers. During stripping of the resist or solder mask, the polymerized regions are debonded from a circuit board in the disclosed strippers. Following removal of the developers and strippers, any residual monomers or polymers of the resist or solder mask as well as residual developing solution and stripping solution are rinsed from the printed circuit package. A method is also disclosed for treating the combined developer and stripper rinse effluents in an activated biomass to reduce the biological oxygen demand of the developer/stripper/resist/solder mask waste streams.