公开(公告)号：DE2554968A1

公开(公告)日：1976-10-21

申请号：DE2554968

申请日：1975-12-06

Applicant: IBM

Inventor： HAINING FRANK WALTON ,  KOLLY JOSEPH MICHAEL ,  LYNCH JUN THOMAS EDMUND

IPC: H01L23/50 ,  H05K3/06 ,  H01L21/92

Abstract: A method for making lead frame devices wherein a thin metal foil is adhered to a stiffener panel by means of a photoresist layer to enable all processing steps by which the metal foil is transformed into an appropriate and predetermined lead frame configuration. After the lead frame fabrication is completed, the photoresist is removed by suitable means and ready for application and functional use as an electronic component electrical connecting device.