公开(公告)号：DE1264953B

公开(公告)日：1968-03-28

申请号：DEJ0022930

申请日：1962-12-27

Applicant: IBM

Inventor： AEBI CLAUDE MAX ,  HAINING FRANK WALTON

IPC: G03C1/58

Abstract: 979, 604. Heat developable diazo materials. INTERNATIONAL BUSINESS MACHINES CORPORATION. Dec. 28, 1962 [Dec. 29, 1961], No. 48743/62. Heading G2C. Light-sensitive heat-developable.diazo materials comprise a light-sensitive diazonium salt, dicyandiamide and a polycarboxylic acid. The three essential components may be incorporated in a single layer cast on a heat-stable substrate or contiguous layers containing (i) dicyandiamide and (ii) the diazonium salt and the acid may be cast on the substrate. Alternatively the substrate may be impregnated with the dicyandiamide and overcoated with a layer comprising the diazonium salt and the acid. The materials have good storage life without adjustment of pH as there are no colour-forming combinations of materials present until heat is applied, a coupler being produced at 120‹ to 150‹C.

公开(公告)号：DE2537444A1

公开(公告)日：1976-03-25

申请号：DE2537444

申请日：1975-08-22

Applicant: IBM

Inventor： HAINING FRANK WALTON ,  RUBINO ROBERT VENANZIO ,  WILEY ROBERT TAYLOR

IPC: H05K3/00 ,  H01B5/14

Abstract: The method of printed circuit production consists of following steps. The laminated board is placed in an atmosphere whose temperature and relative humidity is accurately controlled, so that the laminated board expands in length and width. It is heated at an accurately controlled temperature. It is again placed in an atmosphere whose temperature and relative humidity are accurately controlled. It is then reheated at a strictly controlled temperature, and then recooled. The controlled atmosphere is in the temperature region of 15.6 to 37.8 deg.C and in a relatively dry air atmosphere between 20% and 100%. The treatment cycles are for 10 to 30 minutes.

公开(公告)号：DE2554968A1

公开(公告)日：1976-10-21

申请号：DE2554968

申请日：1975-12-06

Applicant: IBM

Inventor： HAINING FRANK WALTON ,  KOLLY JOSEPH MICHAEL ,  LYNCH JUN THOMAS EDMUND

IPC: H01L23/50 ,  H05K3/06 ,  H01L21/92

Abstract: A method for making lead frame devices wherein a thin metal foil is adhered to a stiffener panel by means of a photoresist layer to enable all processing steps by which the metal foil is transformed into an appropriate and predetermined lead frame configuration. After the lead frame fabrication is completed, the photoresist is removed by suitable means and ready for application and functional use as an electronic component electrical connecting device.