公开(公告)号：CA1224576A

公开(公告)日：1987-07-21

申请号：CA483512

申请日：1985-06-07

Applicant: IBM

Inventor： BECKHAM KEITH F ,  KOLMAN ANNE E ,  MCGUIRE KATHLEEN M ,  PUTTLITZ KARL J ,  QUINONES HORATIO

IPC: H01L21/60 ,  H01L21/56 ,  H05K3/28 ,  H05K3/34

Abstract: Solder Interconnection Structure For Joining Semiconductor Devices To Substrates That Have Improved Fatigue Life, And Process For Making An improved solder interconnection for forming I/O connections between an integrated semiconductor device and a support substrate having a plurality of solder connections arranged in an area array joining a set of I/O's on a flat surface of the semiconductor device to a corresponding set of solder wettable pads on a substrate, the improvement being a band of dielectric organic material disposed between and bonded to the device and substrate embedding at least an outer row of solder connections leaving the center inner solder connections and the adjacent top and bottom surfaces free of dielectric material.