公开(公告)号：DE3170758D1

公开(公告)日：1985-07-04

申请号：DE3170758

申请日：1981-10-29

Applicant: IBM

Inventor： AINSLIE NORMAN GEORGE ,  KRZANOWSKI JAMES EDWARD ,  PALMATEER PAUL HARRY

IPC: B23K1/00 ,  B23K35/00 ,  B23K35/14 ,  B23K35/26 ,  B23K35/30 ,  H01L21/48 ,  B23K35/02

Abstract: Brazing of metallic elements to an electronic circuit board carrying a plurality of chips requires brazing materials which remain strong at high temperatures used to remove and replace the chips attached by solder balls to the board. According to the present invention flanges and pins (19) are brazed to the board (10) with a gold tin brazing solder (15) which is modified during brazing by addition of a Group IB metal (13) to promote formation of the higher melting point β phase of the solder and a Group VIII metal (14) to drawtin out of the melt by gettering. The melting temperature of the brazing solder is raised substantially during brazing to a value above the melting temperature of the solder balls attached to the chips.