公开(公告)号：DE69517788D1

公开(公告)日：2000-08-10

申请号：DE69517788

申请日：1995-12-22

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  GELORME JEFFREY DONALD ,  KUCZYNSKI JOE

IPC: C09J9/02 ,  H01B1/12 ,  C09J201/00

Abstract: An electrically conductive pressure sensitive adhesive containing electrically conductive polymers used as an alternative to metallic solder in interconnect electronic applications.

公开(公告)号：DE69517788T2

公开(公告)日：2000-12-14

申请号：DE69517788

申请日：1995-12-22

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  GELORME JEFFREY DONALD ,  KUCZYNSKI JOE

IPC: C09J9/02 ,  H01B1/12 ,  C09J201/00

Abstract: An electrically conductive pressure sensitive adhesive containing electrically conductive polymers used as an alternative to metallic solder in interconnect electronic applications.